Issue 10/2005
Content (13 Articles)
Thermal oxidation of polycrystalline and single crystalline aluminum nitride wafers
Z. Gu, J. H. Edgar, S. A. Speakman, D. Blom, J. Perrin, J. Chaudhuri
Modeling of the zero-bias resistance-area product of long wavelength infrared HgCdTe-on-Si diodes fabricated from molecular beam epitaxy-grown epitaxial layers
Vishnu Gopal, Sudha Gupta
The correlation between stress relaxation and steady-state creep of eutectic Sn-Pb
W. H. Bang, K. H. Oh, J. P. Jung, J. W. Morris Jr., Fay Hua
Growth and properties of digitally-alloyed AlGaInP by solid source molecular beam epitaxy
O. Kwon, Y. Lin, J. Boeckl, S. A. Ringel
Roughness and texture correlation of Al films
Wenjie Zhang, Leeward Yi, Juineng Tu, Pingyi Chang, Duli Mao, Jin Wu
Simultaneous formation of p- and n-type ohmic contacts to 4H-SiC using the ternary Ni/Ti/Al system
S. Tsukimoto, T. Sakai, T. Onishi, Kazuhiro Ito, Masanori Murakami
A parametric approach for assessment of thermomechanical fatigue performance of Sn-based solder joints
K. N. Subramanian
The joint strength and microstructure of fluxless Au/Sn solders in InP-based laser diode packages
M. T. Sheen, Y. H. Ho, C. L. Wang, K. C. Hsieh, W. H. Cheng
Scanning electron microscope in-situ investigation of fracture behavior in 96.5Sn3.5Ag lead-free solder
Ying Ding, Chunqing Wang, Mingyu Li
Carbon-black thixotropic thermal pastes for improving thermal contacts
Chia-Ken Leong, Yasuhiro Aoyagi, D. D. L. Chung
A comparative study of micropipe decoration and counting in conductive and semi-insulating silicon carbide wafers
Jianwei Wan, Seung-Ho Park, Gilyong Chung, Mark Loboda
Growth of II-IV-V2 chalcopyrite nitrides by molecular beam epitaxy
J. E. van Nostrand, J. D. Albrecht, R. Cortez, K. D. Leedy, B. Johnson, M. J. O’keefe
Solid-state annealing behavior of two high-Pb solders, 95Pb5Sn and 90Pb10Sn, on Cu under bump metallurgy
L. N. Ramanathan, J. W. Jang, J. K. Lin, D. R. Frear