Issue 11/2002
Content (24 Articles)
Solder balling of lead-free solder pastes
Minna Arra, Dongkai Shangguan, Erro Ristolainen, Toivo Lepistö
Experimental determination and thermodynamic calculation of the phase equilibria and surface tension in the Sn-Ag-In system
X. J. Liu, Y. Inohana, Y. Takaku, I. Ohnuma, R. Kainuma, K. Ishida, Z. Moser, W. Gasior, J. Pstrus
Modeling thermomechanical fatigue behavior of Sn-Ag solder joints
J. G. Lee, A. Telang, K. N. Subramanian, T. R. Bieler
Lead-free universal solders for optical and electronic devices
Hareesh Mavoori, Ainissa G. Ramirez, Sungho Jin
Microstructural modifications and properties of Sn-Ag-Cu solder joints induced by alloying
I. E. Anderson, B. A. Cook, J. Harringa, R. L. Terpstra
Reaction characteristics of the Au-Sn solder with under-bump metallurgy layers in optoelectronic packages
Jong-Hwan Park, Jong-Hyun Lee, Yong-Ho Lee, Yong-Seog Kim
Damage accumulation under repeated reverse stressing of Sn-Ag solder joints
K. C. Chen, A. Telang, J. G. Lee, K. N. Subramanian
Effect of heat treatment on the electrical resistivity of near-eutectic Sn-Ag-Cu Pb-Free solder alloys
B. A. Cook, I. E. Anderson, J. L. Harringa, R. L. Terpstra
Nucleation kinetics of Cu6Sn5 by reaction of molten tin with a copper substrate
R. A. Gagliano, G. Ghosh, M. E. Fine
Interfacial microstructure of Pb-free and Pb-Sn solder balls in the ball-grid array package
Chin-Su Chi, Hen-So Chang, Ker-Chang Hsieh, C. L. Chung
The effect of flux chemistry, applied voltage, conductor spacing, and temperature on conductive anodic filament formation
W. J. Ready, L. J. Turbini
Surface-tension measurements of the eutectic alloy (Ag-Sn 96.2 at.%) with Cu additions
Z. Moser, W. Gasior, J. Pstruś, S. Ksiezarek
Phenomena of electroless Ni-P and intermetallic-compound stripping and dissolving in Sn-Bi and Sn-Pb solder joints with Au/EN/Cu metallization
Chien-Sheng Huang, Jih-Hung Yeh, Bi-Lian Young, Jenq-Gong Duh
Isothermal solidification of Cu/Sn diffusion couples to form thin-solder joints
J. S. Kang, R. A. Gagliano, G. Ghosh, M. E. Fine
Experimental investigation of Ge-doped Bi-11Ag as a new Pb-free solder alloy for power die attachment
John N. Lalena, Nancy F. Dean, Martin W. Weiser
Failure mechanism of lead-free solder joints in flip chip packages
Fan Zhang, Ming Li, Bavani Balakrisnan, William T. Chen
Inhibiting the formation of (Au1−xNix)Sn4 and reducing the consumption of Ni metallization in solder joints
C. E. Ho, L. C. Shiau, C. R. Kao
Lead-free ball-grid array balls: Production method and properties
B. Kempf, M. Graff, O. Hutin, M. Rettenmayr
High creep resistance tin-based alloys for soldering applications
Rodney J. Mccabe, Morris E. Fine
A study of the effects of solder volume on the interfacial reactions in solder joints using the differential scanning calorimetry technique
W. K. Choi, S. K. Kang, D. -Y. Shih
Studies of the mechanical and electrical properties of lead-free solder joints
S. K. Kang, W. K. Choi, M. J. Yim, D. Y. Shih
Microstructure of a lead-free composite solder produced by an in-situ process
Seong-Yong Hwang, Joo-Won Lee, Zin-Hyoung Lee