Issue 11/2006
Content (22 Articles)
Foreword
Katsuaki Suganuma, Sinn-wen Chen, C. Robert Kao, Hyuck Mo Lee, Douglas J. Swenson, Srinivas Chada
Suppression of tin whisker formation on fine pitch connectors by surface roughening
Makoto Takeuchi, Kouichi Kamiyama, Katsuaki Suganuma
Development of Bi-base high-temperature Pb-free solders with second-phase dispersion: Thermodynamic calculation, microstructure, and interfacial reaction
Yoshikazu Takaku, Ikuo Ohnuma, Ryosuke Kainuma, Yasushi Yamada, Yuji Yagi, Yuji Nishibe, Kiyohito Ishida
Thermal stability of Cu(W) and Cu(Mo) films for advanced barrierless Cu metallization: Effects of annealing time
J. P. Chu, C. H. Lin
Interfacial reactions and mechanical properties of ball-grid-array solder joints using Cu-cored solder balls
Chih-Ming Chen, Huei-Chuan Lin
Kinetics of AuSn4 migration in lead-free solders
C. W. Chang, C. E. Ho, S. C. Yang, C. R. Kao
Kinetic analysis of the interfacial reactions in Ni/Sn/Cu sandwich structures
S. J. Wang, C. Y. Liu
Electromigration effects on intermetallic growth at wire-bond interfaces
H. T. Orchard, A. L. Greer
Numerical prediction of fraction of eutectic phase in Sn−Ag−Cu soldring using the phase-field method
Machiko Ode, Minoru Ueshima, Taichi Abe, Hideyuki Murakami, Hidehiro Onodera
Comparison of Sn2.8Ag20In and Sn10Bi10In solders for intermediate-step soldering
Sun-Kyoung Seo, Moon Gi Cho, Hyuck Mo Lee, Won Kyoung Choi
Lowering of Sn−Sb alloy melting points caused by substrate dissolution
Sinn-Wen Chen, Po-Yin Chen, Chao-Hong Wang
Metal-semiconductor amorphous and nanoscale Ge-phase composites produced by rapid solidification and by devitrification of an amorphous matrix
D. V. Louzguine-Luzgin, A. Inoue
in-situ electromigration study on Sn−Ag−Cu solder joint by digital image speckle analysis
Luhua Xu, John H. L. Pang
Development of a high-strength high-conductivity Cu−Ni−P alloy. Part II: Processing by severe deformation
A. Belyakov, M. Murayama, Y. Sakai, K. Tsuzaki, M. Okubo, M. Eto, T. Kimura
High dielectric constant polymer-ceramic (Epoxy varnish-barium titanate) nanocomposites at moderate filler loadings for embedded capacitors
Jianwen Xu, Swapan Bhattacharya, Pranabes Pramanik, C. P. Wong
Effect of settlement on dense slurry flow in a horizontal channel
R. Yang, D. C. Sun, Seungbae Park
Thermally stable Ge/Cu/Ti ohmic contacts to n-type GaN
Nadeemullah Mahadik, Mulpuri V. Rao, Albert V. Davydov
Effect of glass frit chemistry on the physical and electrical properties of thick-film Ag contacts for silicon solar cells
Mohamed M. Hilali, Srinivasan Sridharan, Chandra Khadilkar, Aziz Shaikh, Ajeet Rohatgi, Steve Kim
Effects of Cu and Pd addition on Au bonding wire/Al pad interfacial reactions and bond reliability
Sang-Ah Gam, Hyoung-Joon Kim, Jong-Soo Cho, Yong-Jin Park, Jeong-Tak Moon, Kyung-Wook Paik
Realization of very long wavelength infrared photovoltaic detector arrays on mercury cadmium telluride epitaxial layers grown on Si substrates
S. Gupta, V. Gopal, R. P. Tandon
elemental redistribution and interfacial reaction mechanism for the flip chip Sn-3.0Ag-(0.5 or 1.5)Cu solder bump with Al/Ni(V)/Cu under-Bump metallization during aging
Guh-Yaw Jang, Jenq-Gong Duh