Issue 11/2009
Content (27 Articles)
Foreword
Chih-ming Chen, Srinivas Chada, Sinn-wen Chen, Hans Flandorfer, A. Lindsay Greer, Jae-ho Lee, Kejun Zeng, Yee-wen Yen, Wojciech Gierlotka, Chao-hong Wang
Interfacial Reactions of Sn-9Zn-xCu (x = 1, 4, 7, 10) Solders with Ni Substrates
Wei-kai Liou, Yee-Wen Yen, Chien-Chung Jao
Temperature Effect on Intermetallic Compound Growth Kinetics of Cu Pillar/Sn Bumps
Gi-Tae Lim, Byoung-Joon Kim, Kiwook Lee, Jaedong Kim, Young-Chang Joo, Young-Bae Park
Fundamental Study of the Intermixing of 95Pb-5Sn High-Lead Solder Bumps and 37Pb-63Sn Pre-Solder on Chip-Carrier Substrates
C. C. Chang, Y. W. Lin, Y. S. Lai, C. R. Kao
Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging
Moon Gi Cho, Sung K. Kang, Sun-Kyoung Seo, Da-Yuan Shih, Hyuck Mo Lee
Fifteen-Nanometer Ru Diffusion Barrier on NiSi/Si for a sub-45 nm Cu Contact Plug
Jia-Huei Lin, Jiing-Herng Lee, Chen-Sheng Hsu, Jau-Shiung Fang
Cross-Interaction Between Au/Sn and Cu/Sn Interfacial Reactions
Yee-Wen Yen, H. W. Tseng, K. Zeng, S. J. Wang, C. Y. Liu
Enhancement in Conductivity and Transmittance of Zinc Oxide Prepared by Chemical Bath Deposition
Wei-Hsiang Luo, Ting-Kan Tsai, Jen-Chieh Yang, Wei-Ming Hsieh, Chia-His Hsu, Jau-Shiung Fang
Dewetting Retardation on Ag/Cu Coated Light Emitting Diode Lead Frames During the Solder Immersion Process
Kuan-Chih Huang, Fuh-Sheng Shieu, Y. H. Hsiao, C. Y. Liu
The Ni-rich Part of the Ni-P-Sn System: Isothermal Sections
C. Schmetterer, J. Vizdal, A. Kroupa, A. Kodentsov, H. Ipser
Wetting Properties and Interfacial Reactions of Mechanically Alloyed Cu5Zn8-Bearing Pb-Free Solders on a Copper Substrate
Inyu Jung, Moon Gi Cho, Hyuck Mo Lee
In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays
Albert T. Wu, Chun-Yang Tsai, Chin-Li Kao, Meng-Kai Shih, Yi-Shao Lai, Hsin-Yi Lee, Ching-Shun Ku
Controlled Growth of Non-Uniform Arsenic Profiles in Silicon Reduced-Pressure Chemical Vapor Deposition Epitaxial Layers
M. Popadić, T. L. M. Scholtes, W. de Boer, F. Sarubbi, L. K. Nanver
Analysis of Dislocation Density in Pb(1−x)Sn x Se Grown on ZnTe/Si by MBE
P. J. Taylor, N. K. Dhar, E. Harris, V. Swaminathan, Y. Chen, W. A. Jesser
Ohmic Contact to High-Aluminum-Content AlGaN Epilayers
Surendra Srivastava, Seong Mo Hwang, Md. Islam, K. Balakrishnan, Vinod Adivarahan, Asif Khan
Desmearing of FR4 Epoxy Resin Using NMP-Based Sweller
Yung-Chi Cheng, Chin-Hao Hsu, Kuo-Hsing Lan, Jose C. Muñoz, Alvin R. Caparanga, Allan N. Soriano, Meng-Hui Li
Primary Creep in Sn3.8Ag0.7Cu Solder. Part I: Theory, Experiments, and Data Reduction
D. R. Shirley, J. K. Spelt
Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints
X. N. Du, J. D. Guo, J. K. Shang
Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys
Leonardo R. Garcia, Wislei R. Osório, Leandro C. Peixoto, Amauri Garcia
Hygrothermal Effects on the Tensile Properties of Anisotropic Conductive Films
Yunhui Mei, Xu Chen, Hong Gao