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Journal of Electronic Materials

Issue 11/2009

Content (27 Articles)

Foreword

Chih-ming Chen, Srinivas Chada, Sinn-wen Chen, Hans Flandorfer, A. Lindsay Greer, Jae-ho Lee, Kejun Zeng, Yee-wen Yen, Wojciech Gierlotka, Chao-hong Wang

Temperature Effect on Intermetallic Compound Growth Kinetics of Cu Pillar/Sn Bumps

Gi-Tae Lim, Byoung-Joon Kim, Kiwook Lee, Jaedong Kim, Young-Chang Joo, Young-Bae Park

Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging

Moon Gi Cho, Sung K. Kang, Sun-Kyoung Seo, Da-Yuan Shih, Hyuck Mo Lee

Fifteen-Nanometer Ru Diffusion Barrier on NiSi/Si for a sub-45 nm Cu Contact Plug

Jia-Huei Lin, Jiing-Herng Lee, Chen-Sheng Hsu, Jau-Shiung Fang

Cross-Interaction Between Au/Sn and Cu/Sn Interfacial Reactions

Yee-Wen Yen, H. W. Tseng, K. Zeng, S. J. Wang, C. Y. Liu

Enhancement in Conductivity and Transmittance of Zinc Oxide Prepared by Chemical Bath Deposition

Wei-Hsiang Luo, Ting-Kan Tsai, Jen-Chieh Yang, Wei-Ming Hsieh, Chia-His Hsu, Jau-Shiung Fang

The Ni-rich Part of the Ni-P-Sn System: Isothermal Sections

C. Schmetterer, J. Vizdal, A. Kroupa, A. Kodentsov, H. Ipser

In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays

Albert T. Wu, Chun-Yang Tsai, Chin-Li Kao, Meng-Kai Shih, Yi-Shao Lai, Hsin-Yi Lee, Ching-Shun Ku

Open Access

Controlled Growth of Non-Uniform Arsenic Profiles in Silicon Reduced-Pressure Chemical Vapor Deposition Epitaxial Layers

M. Popadić, T. L. M. Scholtes, W. de Boer, F. Sarubbi, L. K. Nanver

Analysis of Dislocation Density in Pb(1−x)Sn x Se Grown on ZnTe/Si by MBE

P. J. Taylor, N. K. Dhar, E. Harris, V. Swaminathan, Y. Chen, W. A. Jesser

Ohmic Contact to High-Aluminum-Content AlGaN Epilayers

Surendra Srivastava, Seong Mo Hwang, Md. Islam, K. Balakrishnan, Vinod Adivarahan, Asif Khan

Desmearing of FR4 Epoxy Resin Using NMP-Based Sweller

Yung-Chi Cheng, Chin-Hao Hsu, Kuo-Hsing Lan, Jose C. Muñoz, Alvin R. Caparanga, Allan N. Soriano, Meng-Hui Li

Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys

Leonardo R. Garcia, Wislei R. Osório, Leandro C. Peixoto, Amauri Garcia