Journal of Electronic Materials

Foreword

Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps

Myeong-Hyeok Jeong, Gi-Tae Lim, Byoung-Joon Kim, Ki-Wook Lee, Jae-Dong Kim, Young-Chang Joo, Young-Bae Park

Study of the Effects of Zn Content on the Interfacial Reactions Between Sn-Zn Solders and Ni Substrates at 250°C

Chao-hong Wang, Hsien-hsin Chen

Growth Mechanism of a Ternary (Cu,Ni)6Sn5 Compound at the Sn(Cu)/Ni(P) Interface

T. S. Huang, H. W. Tseng, C. T. Lu, Y. H. Hsiao, Y. C. Chuang, C. Y. Liu

Influence of Palladium Thickness on the Soldering Reactions Between Sn-3Ag-0.5Cu and Au/Pd(P)/Ni(P) Surface Finish

W. H. Wu, C. S. Lin, S. H. Huang, C. E. Ho

Effects on Undercooling and Interfacial Reactions with Cu Substrates of Adding Bi and In to Sn-3Ag Solder

Yu-Yan Chiang, Robbin Cheng, Albert T. Wu

Study of Interfacial Reactions Between Sn(Cu) Solders and Ni-Co Alloy Layers

K. C. Huang, F. S. Shieu, T. S. Huang, C. T. Lu, C. W. Chen, H. W. Tseng, S. L. Cheng, C. Y. Liu

Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multilayer Substrate

Yee-Wen Yen, Da-Wei Liaw, Kuen-Da Chen, Hao Chen

Co Solubility in Sn and Interfacial Reactions in Sn-Co/Ni Couples

Sinn-wen Chen, Yu-kai Chen, Hsin-jay Wu, Yu-chih Huang, Chih-ming Chen

Elastic Moduli of (Ni,Cu)3Sn4 Ternary Alloys from First-Principles Calculations

Feng Gao, Jianmin Qu

Control of Interface Traps in HfO2 Gate Dielectric on Silicon

S. Y. Tan

The Application of Barrierless Metallization in Making Copper Alloy, Cu(RuHfN), Films for Fine Interconnects

C.H. Lin, W.K. Leau, C.H. Wu

In Situ Temperature Measurement of GaN-Based Ultraviolet Light-Emitting Diodes by Micro-Raman Spectroscopy

Yaqi Wang, Hui Xu, Siddharth Alur, Yogesh Sharma, An-Jen Cheng, Kilho Kang, Ryan Josefsberg, Minseo Park, Sharukh Sakhawat, Arindra N. Guha, Okechukwu Akpa, Saritha Akavaram, Kalyankumar Das

Electrical and Optical Characterization of AlGaN/GaN HEMTs with In Situ and Ex Situ Deposited SiN x Layers

Marko J. Tadjer, Travis J. Anderson, Karl D. Hobart, Michael A. Mastro, Jennifer K. Hite, Joshua D. Caldwell, Yoosuf N. Picard, Fritz J. Kub, Charles R. Eddy Jr.

Optimal Electrical Conductivity for Maximum Thermoelectric Figure of Merit

Gao Min

Chalcopyrite/Si Heterojunctions for Photovoltaic Applications

O. Akpa, S. Shoieb, T. Thompson, T. Isaacs-Smith, P. Anderson, S. Seraphin, K. Das

Light-Harvesting in n-ZnO/p-Silicon Heterojunctions

L. Li, C. X. Shan, B. H. Li, B. Yao, D. Z. Shen, B. Chu, Y. M. Lu

High-Temperature Capacitor Based on Ca-Doped Bi0.5Na0.5TiO3-BaTiO3 Ceramics

Y. Yuan, X. H. Zhou, C. J. Zhao, B. Li, S. R. Zhang

Recrystallization of Electrodeposited Copper Thin Films During Annealing

N. Alshwawreh, M. Militzer, D. Bizzotto

Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent, n, and Implications for EM Reliability Assessment

A.S. Budiman, C.S. Hau-Riege, W.C. Baek, C. Lor, A. Huang, H.S. Kim, G. Neubauer, J. Pak, P.R. Besser, W.D. Nix

Investigation of Void Nucleation and Propagation in the Joule Heating Effect During Electromigration in Flip-Chip Solder Joints

Y. W. Chang, S. H. Chiu, Chih Chen

Impression Creep Behavior of Zn-Sn High-Temperature Lead-Free Solders

R. Mahmudi, M. Eslami