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Journal of Electronic Materials

Issue 2/2000

Content (13 Articles)

Regular Issue Paper

Initial stages of GaN/GaAs (100) growth by metalorganic chemical vapor deposition

Dapeng Xu, Hui Yang, J. B. Li, S. F. Li, Y. T. Wang, D. G. Zhao, R. H. Wu

Regular Issue Paper

Effects of surface porosity on tungsten trioxide(WO3) films’ electrochromic performance

W. J. Lee, Y. K. Fang, Jyh-Jier Ho, W. T. Hsieh, S. F. Ting, Daoyang Huang, Fang C. Ho

Regular Issue Paper

Wafer bonding of 75 mm diameter GaP to AlGaInP-GaP light-emitting diode wafers

I. -H. Tan, D. A. Vanderwater, J. -W. Huang, G. E. Hofler, F. A. Kish, E. I. Chen, T. D. Ostentowski

Regular Issue Paper

Etching behavior of GaAs/AlGaAs multilayer structure during laser beam scanning

Se-Ki Park, Cheon Lee, Eun Kyu Kim

Regular Issue Paper

The removal of deformed submicron particles from silicon wafers by spin rinse and megasonics

Fan Zhang, Ahmed A. Busnaina, Michael A. Fury, Shi-Qing Wang

Regular Issue Paper

Effect of high-temperature annealing on GaInP/GaAs HBT structures grown by LP-MOVPE

F. Brunner, E. Richter, T. Bergunde, I. Rechenberg, A. Bhattacharya, A. Maassdorf, J. W. Tomm, P. Kurpas, M. Achouche, J. Würfl, M. Weyers

Regular Issue Paper

Phosphorus implantation into 4H-silicon carbide

M. A. Capano, R. Santhakumar, R. Venugopal, M. R. Melloch, J. A. Cooper Jr.

Regular Issue Paper

Dry-etch fabrication of reduced area InGaAs/InP DHBT devices for high speed circuit applications

R. F. Kopf, R. A. Hamm, Y. -C. Wang, R. W. Ryan, A. Tate, M. A. Melendes, R. Pullela, Y. -K. Chen, J. Thevin

Regular Issue Paper

High-temperature hysteretic electronic effects of (AlxGa1−x)0.5In0.5P (x>0.65)

B. Bieg, J. G. Cederberg, T. F. Kuech

Regular Issue Paper

The adhesion strength of A lead-free solder hot-dipped on copper substrate

Shan-Pu Yu, Min-Hsiung Hon, Moo-Chin Wang

Review paper

Creep phenomena in lead-free solders

V. I. Igoshev, J. I. Kleiman