Issue 2/2006
Content (27 Articles)
Chemical vapor deposition synthesis of self-aligned carbon nanotube arrays
Stephan P. Turano, Jud Ready
A rapid growth of aligned carbon nanotube films and high-aspect-ratio arrays
Lingbo Zhu, Jianwen Xu, Yonghao Xiu, Dennis W. Hess, C. P. Wong
Indium and tin oxide nanowires by vapor-liquid-solid growth technique
Pho Nguyen, Sreeram Vaddiraju, M. Meyyappan
Molecular dynamics study of bamboo-like carbon nanotube nucleation
Feng Ding, Kim Bolton, Arne Rosén
Synthesis optimization and characterization of multiwalled carbon nanotubes
Christian P. Deck, Gregg S. B. McKee, Kenneth S. Vecchio
Effect of the fabrication method on the electrical properties of poly(acrylonitrile-co-butadiene-co-styrene)/carbon black composites
Sidhartha Gupta, Runqing Ou, Rosario A. Gerhardt
A diameter-selective chiral separation of single-wall carbon nanotubes using nitronium lons
Kay Hyeok An, Chol-Min Yang, Ji Yeong Lee, Seong Chu Lim, Chul Kang, Joo-Hiuk Son, Mun Seok Jeong, Young Hee Lee
Optimization of active region for 1.3-µm GalnAsP compressive-strain multiple-quantum-well ridge waveguide laser diodes
Po-Hsun Lei, Chyi-Dar Yang, Ming-Yuan Wu, Chih-Wei Hu, Meng-Chyi Wu, Yin-Hsun Huang, Wen-Jeng Ho
Reliability of lead-free interconnections under consecutive thermal and mechanical loadings
T. T. Mattila, J. K. Kivilahti
A comparative study of metamorphic InP/InGaAs double heterojunction bipolar transistors with InP and InAIP buffer layers grown by molecular beam epitaxy
Yongkun Sin, Nathan Presser, Paul Adams
Innovative wire bonding method using a chemically reacted thin layer for chips with copper interconnects
Yeau Ren Jeng, Sang Mao Chiu
Lead contamination of a transient liquid-phase-processed Sn-Bi lead-free solder paste
M. Whitney, S. F. Corbin
Effects of strain ratio and tensile hold time on low-cycle fatigue of lead-free Sn-3.5Ag-0.5Cu solder
Chin-Kuang Lin, Chun-Ming Huang
Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes
T. H. Chuang, S. F. Yen, M. D. Cheng
Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish
Tung-Han Chuang, Shiu-Fang Yen, Hui-Min Wu
Solid-state reaction in an Au wire connection with an Al-Cu pad during aging
Guh-Yaw Jang, Jenq-Gong Duh, Hideyuki Takahashi, David Su
Characterization technique in phase distribution during sample preparation for applications to solder joints and wire-bonding chips
Hung-Kai Chen, Shih-Hai Li, Jenq-Gong Duh
Phase distribution and phase analysis in Cu6Sn5, Ni3Sn4, and the Sn-rich corner in the ternary Sn-Cu-Ni isotherm at 240°C
Chia-Ying Li, Guo-Jyun Chiou, Jenq-Gong Duh
Effects of annealing on the thermoelectric and microstructural properties of deformed n-type Bi2Te3-based compounds
D. M. Lee, C. H. Lim, D. C. Cho, Y. S. Lee, C. H. Lee
Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couples
C. W. Chang, Q. P. Lee, C. E. Ho, C. R. Kao
Effects of strain rates and biaxial stress conditions on plastic yielding and flow stress of solder alloys
J. Liang, N. Dariavach, G. Barr, Z. Fang