Issue 2/2008
Content (15 Articles)
Fabrication and Properties of an Asymmetric Waveguide Containing Nanoparticles
J.L. Zhang, T.F. Kuech
Preparation and Characterization of CdTe for Solar Cells, Detectors, and Related Thin-Film Materials
Nazar Abbas Shah, Abid Ali, Asghari Maqsood
Helium-Plasma-Prepared (111)A HgCdTe and (211)B InSb
Michael Martinka, Marvin Jaime-Vasquez, Andrew J. Stoltz, Leo A. Almeida, James D. Benson, John B. Varesi, J.K. Markunas
Electrical Switching in TlSbSe2 Chalcogenide Semiconductors
N. Kalkan, S. Yildirim, K. Ulutas, D. Deger
Ir Diffusion Barriers in Ni/Au Ohmic Contacts to p-Type CuCrO2
W.T. Lim, P.W. Sadik, D.P. Norton, B.P. Gila, S.J. Pearton, I.I. Kravchenko, F. Ren
Investigation of Laser-Assisted Microcrystalline SiGe Films Deposited at Low Temperature
Li-Wen Lai, Hsin-Ying Lee, Jun-Hung Cheng, Ching-Ting Lee
Improvement in Power Durability of Al Electrode Films Used in SAW Devices by Zr Additive and Ti Underlayer
Dongmei Li, Qiang Li, F. Pan
Secondary Current Crowding Effect during Electromigration of Flip-Chip Solder Joints
J.W. Jang, L.N. Ramanathan, J. Tang, D.R. Frear
Deformation Behavior of Sn-3.8Ag-0.7Cu Solder at Intermediate Strain Rates: Effect of Microstructure and Test Conditions
Xin Long, Indranath Dutta, Vijay Sarihan, Darrel R. Frear
Ball Impact Responses of Ni- or Ge-Doped Sn-Ag-Cu Solder Joints
Yi-Shao Lai, Jenn-Ming Song, Hsiao-Chuan Chang, Ying-Ta Chiu
Thermodynamic Assessments of the Ag-Ni Binary and Ag-Cu-Ni Ternary Systems
Xing Jun Liu, Feng Gao, Cui Ping Wang, Kiyohito Ishida
Effect of Polyethylene Glycol Additives on Pulse Electroplating of SnAg Solder
Hsiao-Yun Chen, Chih Chen, Pu-Wei Wu, Jia-Min Shieh, Shing-Song Cheng, Karl Hensen