Issue 2/2010
Content (16 Articles)
Formation of Hybrid Inorganic/Organic Nanocomposites
Tamara V. Basova, Nadezhda M. Kurochkina, Aslan Yu. Tsivadze, Asim K. Ray
Photodefinable Epoxycyclohexyl Polyhedral Oligomeric Silsesquioxane
Nathan Fritz, Rajarshi Saha, Sue Ann Bidstrup Allen, Paul A. Kohl
Using Phosphorus-Doped α-Si Gettering Layers to Improve NILC Poly-Si TFT Performance
Bau-Ming Wang, YewChung Sermon Wu
Open Access
Chemical Vapor Deposition of α-Boron Layers on Silicon for Controlled Nanometer-Deep p + n Junction Formation
Francesco Sarubbi, Tom L. M. Scholtes, Lis K. Nanver
Compositional and Strain Characterization of Ion-Beam-Synthesized Ge x Si1−x Thin Films
K. Hossain, V. C. Kummari, O. W. Holland, B. Rout, J. L. Duggan, F. D. McDaniel
Comparison of Bowing Behaviors Between III–V and II–VI Common-Cation Semiconductor Ternary Alloys
Nacir Tit, Noureddine Amrane, Ali Hussain Reshak
Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder Joints
Hsiu-Jen Lin, Tung-Han Chuang
Interfacial Reactions Between Sn-Zn Alloys and Ni Substrates
WenJun Zhu, HuaShan Liu, JinSan Wang, Guang Ma, ZhanPeng Jin
Impression Creep of a Lead-Free Sn-1.7Sb-1.5Ag Solder Reinforced by Submicron-Size Al2O3 Particles
M. Kangooie, R. Mahmudi, A.R. Geranmayeh
Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder
Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, J. Wei
Interfacial Reaction of Sn and Cu-xZn Substrates After Reflow and Thermal Aging
Chi-Yang Yu, Kai-Jheng Wang, Jenq-Gong Duh
Influence of Asymmetrical Waveform on Low-Cycle Fatigue Life of Micro Solder Joint
Yoshihiko Kanda, Yoshiharu Kariya
Preparation and Ferroelectric Properties of Ho3+/Mo6+ Cosubstituted Bi4Ti3O12 Thin Films by Sol–Gel Method
Chengju Fu, Zhixiong Huang, Jie Li, Dongyun Guo