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Journal of Electronic Materials

Issue 3/2004

Content (13 Articles)

Regular Issue Paper

The contact characteristics of SiCN films for opto-electrical devices applications

Wen-Rong Chang, Yean-Kuen Fang, Shyh-Fann Ting, Shih-Fang Chen, Chun-Yu Lin, Sheng-Beng Hwang, Cheng-Nan Chang

Regular Issue Paper

Characterization survey of GaxIn1−xAs/InAsyP1−y double heterostructures and InAsyP1−y multilayers grown on InP

S. P. Ahrenkiel, M. W. Wanlass, J. J. Carapella, L. M. Gedvilas, B. M. Keyes, R. K. Ahrenkiel, H. R. Moutinho

Regular Issue Paper

Pressure electrical contact improved by carbon black paste

Chia-Ken Leong, D. D. L. Chung

Regular Issue Paper

Oxygen segregation and Ge diffusion in annealed oxygen ion-implanted relaxed SiGe/Si heterostructures

Zhenghua An, Miao Zhang, Ricky K. Y. Fu, Paul K. Chu, Chenglu Lin

Regular Issue Paper

Wafer bonding and epitaxial transfer of GaSb-based epitaxy to GaAs for monolithic interconnection of thermophotovoltaic devices

C. A. Wang, D. A. Shiau, P. G. Murphy, P. W. O’Brien, R. K. Huang, M. K. Connors, A. C. Anderson, D. Donetsky, S. Anikeev, G. Belenky, D. M. Depoy, G. Nichols

Regular Issue Paper

Study on Cu particles-enhanced SnPb composite solder

Yanfu Yan, Jianping Liu, Yaowu Shi, Zhidong Xia

Regular Issue Paper

Electrical and luminescent properties and the spectra of deep centers in GaMnN/InGaN light-emitting diodes

A. Y. Polyakov, N. B. Smirnov, A. V. Govorkov, Jihyun Kim, F. Ren, G. T. Thaler, R. M. Frazier, B. P. Gila, C. R. Abernathy, S. J. Pearton, I. A. Buyanova, G. Y. Rudko, W. M. Chen, C. -C. Pan, G. -T. Chen, J. -I. Chyi, J. M. Zavada