Issue 3/2007
Content (12 Articles)
Regular Issue Paper
Understanding the Effects of Stress on the Crystallization of Amorphous Silicon
Li Cai, Min Zou, Husam Abu-Safe, Hameed Naseem, William Brown
Regular Issue Paper
Phase Equilibria of the Sn-Ag-Cu-Ni Quaternary System at 210°C
S.-W. Chen, C.-N. Chiu, K.-C. Hsieh
Hillock and Whisker Growth on Sn and SnCu Electrodeposits on a Substrate Not Forming Interfacial Intermetallic Compounds
M.E. Williams, K.-W. Moon, W.J. Boettinger, D. Josell, A.D. Deal
Microstructure of External Stress Whiskers and Mechanical Indentation Test Method
Hiroyuki Moriuchi, Yoshihiro Tadokoro, Masahide Sato, Takeshi Furusawa, Noboru Suzuki
Regular Issue Paper
Failure Mechanisms of Thermomechanically Loaded SnAgCu/Plastic Core Solder Ball Composite Joints in Low-Temperature Co-Fired Ceramic/Printed Wiring Board Assemblies
O. NOUSIAINEN, J. PUTAALA, T. KANGASVIERI, R. RAUTIOAHO, J. VÄHÄKANGAS
A Novel Electroless Process for Embedding a Thin Film Resistor on the Benzocyclobutene Dielectric
Swapan K. Bhattacharya, Mahesh G. Varadarajan, Premjeet Chahal, Gopal C. Jha, Rao R. Tummala
Synthesis of Nanometric-Sized Barium Titanate Powders Using Acetylacetone as the Chelating Agent in a Sol-Precipitation Process
Kun Ming Hung, Ching Shieh Hsieh, Wein Duo Yang, Hui Ju Tsai
Letter
Memory Effect of Metal-Insulator-Silicon Capacitor with HfO2-Al2O3 Multilayer and Hafnium Nitride Gate
Shi-Jin Ding, Min Zhang, Wei Chen, David Wei Zhang, Li-Kang Wang
Effect of Annealing Ambient on the Self-Formation Mechanism of Diffusion Barrier Layers Used in Cu(Ti) Interconnects
S. Tsukimoto, T. Kabe, K. Ito, M. Murakami