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Journal of Electronic Materials

Issue 3/2013

Content (29 Articles)

Thermal Cycling, Mechanical Degradation, and the Effective Figure of Merit of a Thermoelectric Module

M. T. Barako, W. Park, A. M. Marconnet, M. Asheghi, K. E. Goodson

Creation of Yb2O3 Nanoprecipitates Through an Oxidation Process in Bulk Yb-Filled Skutterudites

Juan Ding, Hui Gu, Pengfei Qiu, Xihong Chen, Zhen Xiong, Qiang Zheng, Xun Shi, Lidong Chen

Effect of Temperature Cycling on Conduction Mechanisms in CdTe Thin Films

V. Srivastav, R. Pal, N. Saini, R. S. Saxena, R. K. Bhan, L. Sareen, K. P. Singh, R. K. Sharma, V. Venkataraman

Performance Enhancement of Crystalline Silicon Solar Cells by Coating with Luminescent Silicon Nanostructures

Tuhin Shuvra Basu, Mallar Ray, Nil Ratan Bandyopadhyay, Ashit Kumar Pramanick, Syed Minhaz Hossain

Screen-Printable Silver Pastes with Nanosized Glass Frits for Silicon Solar Cells

Yu-Chou Shih, Yeong-Her Lin, Jiun-Pyng You, Frank G. Shi

The Role of the Nickel Catalyst and Its Chemical and Structural Evolution During Carbon Nanopearl Growth

S. Pacley, W. C. Mitchel, P. T. Murray, D. Anderson, H. E. Smith, E. Beck-Millerton, A. A. Voevodin

Electrical and Pyroelectric Properties of K2Pb2Gd2W2Ti4Nb4O30 Ferroelectrics

R. Padhee, Piyush R. Das, B.N. Parida, R.N.P. Choudhary

Dielectric Tunability of DNA Biopolymer Films with Varying Amounts of Hexadecyltrimethylammonium Chloride

Roberto S. Aga Jr., Brian A. Telek, Jack P. Lombardi III, Emily M. Heckman, Carrie M. Bartsch

Effect of Ag Content and the Minor Alloying Element Fe on the Mechanical Properties and Microstructural Stability of Sn-Ag-Cu Solder Alloy Under High-Temperature Annealing

Dhafer Abdulameer Shnawah, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin, Suhana Binti Mohd Said, Tadashi Ariga, Fa Xing Che

Cu–Cu Hermetic Seal Enhancement Using Self-Assembled Monolayer Passivation

D. F. Lim, J. Fan, L. Peng, K. C. Leong, C. S. Tan

Effects of Solvents in the Polyethylene Glycol Series on the Bonding of Copper Joints Using Ag2O Paste

Shinya Takata, Tomo Ogura, Eiichi Ide, Toshiaki Morita, Akio Hirose

Mechanisms of Creep Deformation in Pure Sn Solder Joints

K. -O. Lee, J. W. Morris Jr., Fay Hua

Room-Temperature Nanoindentation Creep of Thermally Cycled Ultrasonically Bonded Heavy Aluminum Wires

P.A. Agyakwa, V.M.F. Marques, M.R. Corfield, J.F. Li, L. Yang, C.M. Johnson

Effect of Annealing Twins on Electromigration in Ag-8Au-3Pd Bonding Wires

Tung-Han Chuang, Hsi-Ching Wang, Chien-Hsun Chuang, Jun-Der Lee, Hsing-Hua Tsai

Development and Status of Cu Ball/Wedge Bonding in 2012

Martin Schneider-Ramelow, Ute Geißler, Stefan Schmitz, Wolfgang Grübl, Bernhard Schuch

Erratum

Erratum to: Thermoelectric Energy Harvesting from Transient Ambient Temperature Gradients

André Moser, Metin Erd, Milos Kostic, Keith Cobry, Michael Kroener, Leonhard M. Reindl, Peter Woias