Issue 4/2008
Content (23 Articles)
Modeling of Magnetic-Field-Assisted Assembly of Semiconductor Devices
Rene D. Rivero, Sudhakar Shet, Michael R. Booty, Anthony T. Fiory, Nuggehalli M. Ravindra
Morphology of Thick SiC Epitaxial Films Grown by the Physical Vapor Transport Method
B.P. Wagner, N.B. Singh, A. Berghmans, D.J. Knuteson, D. Kahler, S. McLaughlin, J. Hawkins, J. Golombeck
Microwave Performance of AlGaN/GaN High-Electron-Mobility Transistors on Si/SiO2/Poly-SiC Substrates
T.J. Anderson, F. Ren, J. Kim, J. Lin, M. Hlad, B.P. Gila, L. Voss, S.J. Pearton, P. Bove, H. Lahreche, J. Thuret
Luminescence of Long-Term Ordered Pure and Doped Gallium Phosphide
Sergei Pyshkin, John Ballato, Michael Bass, Giorgio Turri
Relationship of Band-Edge Luminescence to Recombination Lifetime in Silicon Wafers
R.K. Ahrenkiel, S.W. Johnston, W.K. Metzger, P. Dippo
Study of Fracture Mechanics in Testing Interfacial Fracture of Solder Joints
W.H. Bang, M.-W. Moon, C.-U. Kim, S.H. Kang, J.P. Jung, K.H. Oh
Analysis of Barrier Defects in Low-k/Cu Interconnects Based on Electrochemical Response and Simulation Cell
Dong Mei Meng, Nancy L. Michael, Young-Joon Park, Choong-Un Kim
Practical Surface Treatments and Surface Chemistry of n-Type and p-Type GaN
J.J. Uhlrich, L.C. Grabow, M. Mavrikakis, T.F. Kuech
Antioxidant-Based Phase-Change Thermal Interface Materials with High Thermal Stability
Yasuhiro Aoyagi, D.D.L. Chung
Temperature Dependence of Electrical and Thermal Conductivities of an Epoxy-Based Isotropic Conductive Adhesive
Masahiro Inoue, Hiroaki Muta, Takuji Maekawa, Shinsuke Yamanaka, Katsuaki Suganuma
Joule Heating Enhanced Phase Coarsening in Sn37Pb and Sn3.5Ag0.5Cu Solder Joints during Current Stressing
B.Y. Wu, M.O. Alam, Y.C. Chan, H.W. ZHONG
Determination of the Elastic Properties of Cu3Sn Through First-Principles Calculations
Rong An, Chunqing Wang, Yanhong Tian, Huaping Wu
Effect of Oxidation on Indium Solderability
Jongman Kim, Harry Schoeller, Junghyun Cho, Seungbae Park
Equi-Axed Grain Formation in Electrodeposited Sn-Bi
E. Sandnes, M.E. Williams, M.D. Vaudin, G.R. Stafford
Liquidus Projection and Solidification of the Sn-In-Cu Ternary Alloys
Shih-Kang Lin, Ching-Feng Yang, Shyr-Harn Wu, Sinn-Wen Chen
Creep Properties of Composite Solders Reinforced with Nano- and Microsized Particles
Yaowu Shi, Jianping Liu, Yanfu Yan, Zhidong Xia, Yongping Lei, Fu Guo, Xiaoyan Li
Effect of Carbon Nanotubes on the Shear Strength and Electrical Resistivity of a Lead-Free Solder
S.M.L. Nai, J. Wei, M. Gupta
Direct Fabrication of Fine Gold Patterns from an Aqueous Solution by a UV Laser
Abbu Udaiyar Senthil Kumaran, Masaya Ichimura
Origin of Surface Defects in PCB Final Finishes by the Electroless Nickel Immersion Gold Process
Bae-Kyun Kim, Seong-Jae Lee, Jong-Yun Kim, Kum-Young Ji, Yeo-Joo Yoon, Mi-Yang Kim, Song-Hae Park, Jong-Soo Yoo