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Journal of Electronic Materials

Issue 7/2001

Content (22 Articles)

Foreword

Karl D. Hobart

Special Issue Paper

InAs/InGaSb photodetectors grown on GaAs bonded substrates

M. F. Vilela, K. A. Anselm, N. Sooriar, J. L. Johnson, C. H. Lin, G. J. Brown, K. Mahalingam, A. Saxler, F. Szmulowicz

Special Issue Paper

Uniaxial, tensile-strained Si devices

Rona E. Belford

Special Issue Paper

Initial nanoheteroepitaxial growth of GaAs on Si(100) by OMVPE

D. Zubia, S. Zhang, R. Bommena, X. Sun, S. R. J. Brueck, S. D. Hersee

Special Issue Paper

High mobility electron heterostructure wafer fused onto LiNbO3

K. J. Friedland, A. Riedel, H. Kostial, M. Höricke, R. Hey, K. H. Ploog

Special Issue Paper

A study of cracking in GaN grown on silicon by molecular beam epitaxy

R. Jothilingam, M. W. Koch, J. B. Posthill, G. W. Wicks

Special Issue Paper

High quality AIN and GaN grown on compliant Si/SiC substrates by gas source molecular beam epitaxy

G. Kipshidze, S. Nikishin, V. Kuryatkov, K. Choi, Ìu. Gherasoiu, T. Prokofyeva, M. Holtz, H. Temkin, K. D. Hobart, F. J. Kub, M. Fatemi

Special Issue Paper

Substrate smoothing using gas cluster ion beam processing

L. P. Allen, D. B. Fenner, V. Difilippo, C. Santeufemio, E. Degenkolb, W. Brooks, M. Mack, J. Hautala

Special Issue Paper

The generic nature of the Smart-Cut® process for thin film transfer

B. Aspar, H. Moriceau, E. Jalaguier, C. Lagahe, A. Soubie, B. Biasse, A. M. Papon, A. Claverie, J. Grisolia, G. Benassayag, F. Letertre, O. Rayssac, T. Barge, C. Maleville, B. Ghyselen

Special Issue Paper

Silicon layer transfer using wafer bonding and debonding

Cynthia Colinge, Brian Roberds, Brian Doyle

Regular Issue Paper

Hydrogen plasma passivation of bulk GaAs and Al0.3Ga0.7As/GaAs multiple-quantum-well structures on Si substrates

G. Wang, T. Ogawa, F. Kunimasa, M. Umeno, T. Soga, T. Jimbo, T. Egawa

Regular Issue Paper

Defects in annealed 1.5 MeV boron implanted p-type silicon

J. Y. Dai, K. K. Ong, D. Z. Chi, M. H. Liang, K. C. Leong, L. Chan, S. K. Lahiri

Regular Issue Paper

Development of Al-free ohmic contact to n-GaN

Dae-Woo Kim, Jun Cheol Bae, Woo Jin Kim, Hong Koo Baik, Cha Yeon Kim, Wook Kim, Yoon Ho Choi, Chin-Kyo Kim, Tae-Kyung Yoo, Chang Hee Hong, Sung-Man Lee

Regular Issue Paper

Spatial distribution of metal fillers in isotropically conductive adhesives

Y. Fu, M. Willander, J. Liu

Regular Issue Paper

Low-noise solar-blind AlxGa1-xN-based metal-semiconductor-metal ultraviolet photodetectors

Ting Li, D. J. H. Lambert, A. L. Beck, C. J. Collins, B. Yang, M. M. Wong, U. Chowdhury, R. D. Dupuis, J. C. Campbell

Regular Issue Paper

N-type doping of 4H-SiC with phosphorus Co-implanted with C or Si

L. Zhu, Z. Li, T. P. Chow

Regular Issue Paper

Structural properties of GaAsN grown on (001) GaAs by metalorganic molecular beam epitaxy

Young-Woo Ok, Chel-Jong Choi, Tae-Yeon Seong, K. Uesugi, I. Suemune