Issue 8/2002
Content (11 Articles)
Special Issue Paper
Noise properties of linear defects in Hg1−xCdxTe
I. S. Virt, W. Obermayr, M. Bilyk, M. Kuzma
Special Issue Paper
The annealing of Cd1−xZnxTe in CdZn vapors
Li Yujie, Ma Guoli, Zhan Xiaona, Jie Wanqi
Special Issue Paper
The effect of strained Al0.7In0.3As emitter layers on abrupt N-p+ AllnAs-GaInAs heterojunction diodes and heterojunction bipolar transistors
Changhyun Yi, Robert A. Metzger, April S. Brown
Special Issue Paper
Fixed-angle, energy-dispersive x-ray reflectivity measurement of thin tantalum film thickness
D. Windover, E. Barnat, J. Summers, T. -M. Lu, A. Kumar, H. Bakhru, S. L. Lee
Special Issue Paper
The effect of O2 ambient annealing on the microstructure of Cu(Mg) in the form of a Cu(Mg)/SiO2/Si multilayer
W. H. Lee, Y. K. Ko, B. J. Kang, B. S. Cho, H. J. Yang, G. S. Chae, H. S. Soh, J. G. Lee
Special Issue Paper
The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys—the effect of Ag
Kang-I. Chen, Kwang-Lung Lin
Special Issue Paper
Low-resistance Ti/Al ohmic contact on undoped ZnO
Soo Young Kim, Ho Won Jang, Jong Kyu Kim, Chang Min Jeon, Won Il Park, Gyu-Chul Yi, Jong-Lam Lee
Special Issue Paper
Interfacial transfer between copper and polyurethane in chemical-mechanical polishing
Hong Liang, Thierry Le Mogne, Jean-Michel Martin
Special Issue Paper
Fatigue crack-growth behavior of Sn-Ag-Cu and Sn-Ag-Cu-Bi lead-free solders
J. Zhao, Y. Mutoh, Y. Miyashita, S. L. Mannan
Special Issue Paper
Evolution of residual-inplane stress during adhesive curing and recuring in chip-on-board packages
Zhiguo Sun, Weidong Huang, Yuqi Jiang, Le Luo
Special Issue Paper
The influence of thermal aging on joint strength and fracture surface of Pb/Sn and Au/Sn solders in laser diode packages
M. T. Sheen, C. M. Chang, H. C. Teng, J. H. Kuang, K. C. Hsieh, W. H. Cheng