Issue 1-3/2007
Special Issue: Lead-Free Electronic Solders Guest Editor: K. N. Subramanian
Content (24 Articles)
Thermodynamics and phase diagrams of lead-free solder materials
H. Ipser, H. Flandorfer, Ch. Luef, C. Schmetterer, U. Saeed
Phase Diagrams of Pb-Free Solders and their Related Materials Systems
Sinn-Wen Chen, Chao-Hong Wang, Shih-Kang Lin, Chen-Nan Chiu
Compression stress–strain and creep properties of the 52In–48Sn and 97In–3Ag low-temperature Pb-free solders
Paul T. Vianco, Jerome A. Rejent, Arlo F. Fossum, Michael K. Neilsen
Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys
N. Chawla, R. S. Sidhu
Life expectancies of Pb-free SAC solder interconnects in electronic hardware
Michael Osterman, Abhijit Dasgupta
Assessment of Factors Influencing Thermomechanical Fatigue Behavior of Sn-Based Solder Joints under Severe Service Environments
K. N. Subramanian
Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages
Seung-Hyun Chae, Xuefeng Zhang, Kuan-Hsun Lu, Huang-Lin Chao, Paul S. Ho, Min Ding, Peng Su, Trent Uehling, Lakshmi N. Ramanathan
Sn-whiskers: truths and myths
J. W. Osenbach, J. M. DeLucca, B. D. Potteiger, A. Amin, F. A. Baiocchi
Impact of the ROHS directive on high-performance electronic systems
Karl J. Puttlitz, George T. Galyon
Impact of the ROHS Directive on high-performance electronic systems
Karl J. Puttlitz, George T. Galyon