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Journal of Materials Engineering and Performance
Published in: Journal of Materials Engineering and Performance 4/2019

22-02-2019

Lead Whisker Formation in the Gold-Lead System

Author: D. E. Helling

Published in: Journal of Materials Engineering and Performance | Issue 4/2019

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Abstract

Metallic whiskers of pure lead (Pb) have been observed in the solder of several types of transistors. The conditions that lead to these whiskers were evaluated, including characterization of the whisker lengths and whisker density as a function of time and temperature. The potential cause and impact they would have on the reliability of electronics has been investigated. Based on these results, it is hypothesized that these whiskers may be caused by the relief of residual stresses that are created during the evolution of Au-In and/or Au-Pb intermetallic compounds or, possibly, by a decomposition of the AuPb3 phase. Due to their small size, the Pb whiskers that were observed were considered to not be a reliability concern, but similar or larger Pb whiskers could cause electrical failure in some applications.
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Metadata
Title
Lead Whisker Formation in the Gold-Lead System
Author
D. E. Helling
Publication date
22-02-2019
Publisher
Springer US
Published in
Journal of Materials Engineering and Performance / Issue 4/2019
Print ISSN: 1059-9495
Electronic ISSN: 1544-1024
DOI
https://doi.org/10.1007/s11665-019-03948-w

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