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Published in:
Overview of MEMS Packaging Technologies Read chapter Read first chapter

2018 | OriginalPaper | Chapter

2. Microcap (or Microstructure) Transfer Techniques

Author : Seonho Seok

Published in: Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering

Publisher: Springer International Publishing

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Abstract

As explained in the previous section, transfer packaging is one of interesting MEMS packaging technologies because it doesn’t have process compatibility issues with main MEMS process. Thus, the different transfer techniques will be thoroughly explained in the following

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previous chapter Overview of MEMS Packaging Technologies
next chapter Polymer Cap Transfer Packaging Technologies
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Metadata
Title
Microcap (or Microstructure) Transfer Techniques
Author
Seonho Seok
Copyright Year
2018
Book
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering

Print ISBN: 978-3-319-77871-6

Electronic ISBN: 978-3-319-77872-3

Copyright Year: 2018

DOI
https://doi.org/10.1007/978-3-319-77872-3_2

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