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Published in: Journal of Materials Science: Materials in Electronics 8/2020

01-04-2020

Microstructure characterization of Al2O3–Mullite–AlN multiphase ceramic film on Cr/WCu substrate

Authors: Jiandong Zhu, Zhen Zheng, Chunqing Wang, Jianguo Liu

Published in: Journal of Materials Science: Materials in Electronics | Issue 8/2020

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Abstract

The sintering mechanism of multiphase ceramic film—made of alumina, mullite and aluminum nitride—fabricated by water vapor-assisted sintering on Cr/WCu substrate was investigated. The multiphase ceramic film and interfacial reaction layer between ceramic film and Cr/WCu substrate were examined to reveal their microstructure by relevant test methods. The multiphase ceramic was composed of α-Al2O3 and mullite-coated aluminum nitride particles. During metastable stage, metastable alumina and amorphous silica were generated, which originated from AlN and PCS, respectively. A structure containing Al–Si–O glass and metastable alumina-coated AlN particle was formed. With firing temperature increasing to 1050 °C, Al–Si–O glass crystallized and generated crystal mullite. Meanwhile, α-Al2O3 was formed from metastable alumina. κ-Al2O3 and Al1.98Cr0.02O3 phases were observed in the interfacial reaction layer by high-resolution transmission electron microscopy. It revealed that the distances of (002) facet for κ-Al2O3 and (104) facet for Al1.98Cr0.02O3 were 0.447 nm and 0.255 nm, respectively. During water vapor-assisted sintering, κ-Al2O3 and Cr2O3 were generated, which were derived from AlN and Cr, respectively. When the sintering temperature was increased to 1050 °C, κ-Al2O3 and Cr2O3 would react with each other and generate Al1.98Cr0.02O3 phase. The Al1.98Cr0.02O3 phase was of great help to improving adhesion strength of multiphase ceramic film on Cr/WCu substrate.

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Literature
1.
go back to reference F. Qi, M. Wang, L. Xu, Investigation and review of challenges in a high-temperature 30-kVA three-phase inverter using SiC MOSFETs. IEEE Trans. Ind. Appl. 54, 2483–2491 (2018)CrossRef F. Qi, M. Wang, L. Xu, Investigation and review of challenges in a high-temperature 30-kVA three-phase inverter using SiC MOSFETs. IEEE Trans. Ind. Appl. 54, 2483–2491 (2018)CrossRef
2.
go back to reference J. Millan, P. Godignon, X. Perpina, A. Perez-Tomas, J. Rebollo, A survey of wide bandgap power semiconductor devices. IEEE Trans. Power Electron. 29, 2155–2163 (2014)CrossRef J. Millan, P. Godignon, X. Perpina, A. Perez-Tomas, J. Rebollo, A survey of wide bandgap power semiconductor devices. IEEE Trans. Power Electron. 29, 2155–2163 (2014)CrossRef
3.
go back to reference H. Umezawa, Recent advances in diamond power semiconductor devices. Mater. Sci. Semicond. Process. 78, 147–156 (2018)CrossRef H. Umezawa, Recent advances in diamond power semiconductor devices. Mater. Sci. Semicond. Process. 78, 147–156 (2018)CrossRef
4.
go back to reference Z. Wang, M. Chinthavali, S. Campbell et al., A 50-kW Air-cooled SiC inverter With 3-D printing enabled power module packaging structure and genetic algorithm optimized heatsinks. IEEE Trans. Ind. Appl. 55, 6256–6265 (2019)CrossRef Z. Wang, M. Chinthavali, S. Campbell et al., A 50-kW Air-cooled SiC inverter With 3-D printing enabled power module packaging structure and genetic algorithm optimized heatsinks. IEEE Trans. Ind. Appl. 55, 6256–6265 (2019)CrossRef
5.
go back to reference T. Funaki, M. Hirano, H. Umezawa, S. Shikata, High temperature switching operation of a power diamond Schottky barrier diode. IEICE Electron. Exp. 9, 1835–1841 (2012)CrossRef T. Funaki, M. Hirano, H. Umezawa, S. Shikata, High temperature switching operation of a power diamond Schottky barrier diode. IEICE Electron. Exp. 9, 1835–1841 (2012)CrossRef
6.
go back to reference M. Locatelli, R. Khazaka, S. Diaham, C. Pham, M. Bechara, S. Dinculescu, P. Bidan, Evaluation of encapsulation materials for high-temperature power electronics packaging. IEEE Trans. Power Electron. 29, 2281–2288 (2014)CrossRef M. Locatelli, R. Khazaka, S. Diaham, C. Pham, M. Bechara, S. Dinculescu, P. Bidan, Evaluation of encapsulation materials for high-temperature power electronics packaging. IEEE Trans. Power Electron. 29, 2281–2288 (2014)CrossRef
7.
go back to reference L.A. Navarro, X. Perpina, P. Godignon, J. Montserrat, V. Banu, M. Vellvehi, X. Jorda, Thermomechanical assessment of die-attach materials for wide bandgap semiconductor devices and harsh environment applications. IEEE Trans. Power Electron. 29, 2261–2271 (2014)CrossRef L.A. Navarro, X. Perpina, P. Godignon, J. Montserrat, V. Banu, M. Vellvehi, X. Jorda, Thermomechanical assessment of die-attach materials for wide bandgap semiconductor devices and harsh environment applications. IEEE Trans. Power Electron. 29, 2261–2271 (2014)CrossRef
8.
go back to reference X. Wei, H. Xu, J. Zhan et al., Comparative studies on microstructures, strengths and reliabilities of two types of AlN direct bonding copper substrates. Ceram. Int. 44, 18935–18941 (2018)CrossRef X. Wei, H. Xu, J. Zhan et al., Comparative studies on microstructures, strengths and reliabilities of two types of AlN direct bonding copper substrates. Ceram. Int. 44, 18935–18941 (2018)CrossRef
9.
go back to reference S. Asai, M. Funaki, H. Sawa, K. Kato, Fabrication of an insulated metal substrate (IMS), having an insulating layer with a high dielectric constant. IEEE Trans. Compon. Hybrids Manuf. Technol 16, 499–504 (1993)CrossRef S. Asai, M. Funaki, H. Sawa, K. Kato, Fabrication of an insulated metal substrate (IMS), having an insulating layer with a high dielectric constant. IEEE Trans. Compon. Hybrids Manuf. Technol 16, 499–504 (1993)CrossRef
10.
go back to reference M. Ma, Z. Liu, Y. Li, Y. Zeng, D. Yao, Enhanced thermal conductivity of low-temperature sintered borosilicate glass-AlN composites with β-Si3N4 whiskers. J. Eur. Ceram. Soc. 33, 833–839 (2013)CrossRef M. Ma, Z. Liu, Y. Li, Y. Zeng, D. Yao, Enhanced thermal conductivity of low-temperature sintered borosilicate glass-AlN composites with β-Si3N4 whiskers. J. Eur. Ceram. Soc. 33, 833–839 (2013)CrossRef
11.
go back to reference F. Boey, L. Sun, X. Song, K.A. Khor, High dielectric AlN/Al2O3 composite powder using a plasma spray approach for microelectronics application. J. Mater. Sci. 10, 455–459 (1999) F. Boey, L. Sun, X. Song, K.A. Khor, High dielectric AlN/Al2O3 composite powder using a plasma spray approach for microelectronics application. J. Mater. Sci. 10, 455–459 (1999)
12.
go back to reference J. Zhu, R. An, C. Wang, W. Zhang, G. Wen, Characterization of the microstructure of an AlN-Mullite-Al2O3 ceramic layer on wcu composite alloy for microelectronic application. J. Electron. Mater. 44, 4154–4160 (2015)CrossRef J. Zhu, R. An, C. Wang, W. Zhang, G. Wen, Characterization of the microstructure of an AlN-Mullite-Al2O3 ceramic layer on wcu composite alloy for microelectronic application. J. Electron. Mater. 44, 4154–4160 (2015)CrossRef
13.
go back to reference J. Zhu, R. An, C. Wang, G. Wen, Fabrication of Al2O3-Mullite-AlN multiphase ceramic layer on W-Cu substrates for power semiconductor packaging. IEEE Trans. Compon. Packag. Manuf. Technol. 5, 182–187 (2015)CrossRef J. Zhu, R. An, C. Wang, G. Wen, Fabrication of Al2O3-Mullite-AlN multiphase ceramic layer on W-Cu substrates for power semiconductor packaging. IEEE Trans. Compon. Packag. Manuf. Technol. 5, 182–187 (2015)CrossRef
14.
go back to reference S. Novak, T. Kosmač, K. Krnel, G. Dražič, Principles of the hydrolysis assisted solidification (HAS) process for forming ceramic bodies from aqueous suspension. J. Eur. Ceram. Soc. 22, 289–295 (2002)CrossRef S. Novak, T. Kosmač, K. Krnel, G. Dražič, Principles of the hydrolysis assisted solidification (HAS) process for forming ceramic bodies from aqueous suspension. J. Eur. Ceram. Soc. 22, 289–295 (2002)CrossRef
15.
go back to reference T. Kosmac, S. Novak, M. Sajko, Hydrolysis-assisted solidification (HAS): a new setting concept for ceramic net-shaping. J. Eur. Ceram. Soc. 17, 427–432 (1997)CrossRef T. Kosmac, S. Novak, M. Sajko, Hydrolysis-assisted solidification (HAS): a new setting concept for ceramic net-shaping. J. Eur. Ceram. Soc. 17, 427–432 (1997)CrossRef
16.
go back to reference Y. Yu, Y. Guo, X. Cheng, Y. Zhang, Preparation of TiO2/SiO2 composite fiber by thermal decomposition of polycarbosilane–tetrabutyl titanate hybrid precursor. J. Mater. Chem. 19, 5637 (2009)CrossRef Y. Yu, Y. Guo, X. Cheng, Y. Zhang, Preparation of TiO2/SiO2 composite fiber by thermal decomposition of polycarbosilane–tetrabutyl titanate hybrid precursor. J. Mater. Chem. 19, 5637 (2009)CrossRef
17.
go back to reference T. Takei, Y. Kameshima, A. Yasumori, K. Okada, Crystallization kinetics of mullite in alumina–silica glass fibers. J. Am. Ceram. Soc. 82, 2876–2880 (1999)CrossRef T. Takei, Y. Kameshima, A. Yasumori, K. Okada, Crystallization kinetics of mullite in alumina–silica glass fibers. J. Am. Ceram. Soc. 82, 2876–2880 (1999)CrossRef
18.
go back to reference J.A. Pask, X.W. Zhang, A.P. Tomsia, B.E. Yoldas, Effect of sol-gel mixing on mullite microstructure and phase equilibria in the α-Al2O3-SiO2 system. J. Am. Ceram. Soc. 70, 704–707 (1987)CrossRef J.A. Pask, X.W. Zhang, A.P. Tomsia, B.E. Yoldas, Effect of sol-gel mixing on mullite microstructure and phase equilibria in the α-Al2O3-SiO2 system. J. Am. Ceram. Soc. 70, 704–707 (1987)CrossRef
19.
go back to reference J. He, W. Liu, L. Zhu, Q. Huang, Phase transformation behaviors of aluminum hydroxides to alpha alumina in air and molten salt. J. Mater. Sci. 40, 3259–3261 (2005)CrossRef J. He, W. Liu, L. Zhu, Q. Huang, Phase transformation behaviors of aluminum hydroxides to alpha alumina in air and molten salt. J. Mater. Sci. 40, 3259–3261 (2005)CrossRef
20.
go back to reference F.J. Pérez-Trujillo, S.I. Castañeda, Study by means of the mass spectrometry of volatile species in the oxidation of Cr, Cr2O3, Al, Al2O3, Si, SiO2, Fe and ferritic/martensitic steel samples at 923 K in Ar+(10 to 80%)H2O vapor atmosphere for new-materials design. Oxid. Metals 66, 231–251 (2006)CrossRef F.J. Pérez-Trujillo, S.I. Castañeda, Study by means of the mass spectrometry of volatile species in the oxidation of Cr, Cr2O3, Al, Al2O3, Si, SiO2, Fe and ferritic/martensitic steel samples at 923 K in Ar+(10 to 80%)H2O vapor atmosphere for new-materials design. Oxid. Metals 66, 231–251 (2006)CrossRef
21.
go back to reference S. Kakooei, J. Rouhi, E. Mohammadpour, M. Alimanesh, A. Dehzangi, Synthesis and characterization of Cr-Doped Al2O3 nanoparticles prepared via aqueous combustion method. Casp. J. Appl. Sci. Res. 1, 16–22 (2012) S. Kakooei, J. Rouhi, E. Mohammadpour, M. Alimanesh, A. Dehzangi, Synthesis and characterization of Cr-Doped Al2O3 nanoparticles prepared via aqueous combustion method. Casp. J. Appl. Sci. Res. 1, 16–22 (2012)
Metadata
Title
Microstructure characterization of Al2O3–Mullite–AlN multiphase ceramic film on Cr/WCu substrate
Authors
Jiandong Zhu
Zhen Zheng
Chunqing Wang
Jianguo Liu
Publication date
01-04-2020
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 8/2020
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-020-03162-8

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