Issue 3/2003
Content (14 Articles)
Micro-structured flow fields for small fuel cells
M. Müller, C. Müller, F. Gromball, M. Wölfle, W. Menz
Chemical mechanical polishing as a toolbox for thin film magnetic head manufacturing
H. van Heeren, T. Bertens, F. Pronk, K. Attenborough
Surface roughness control by energy shift in deep X-ray lithography
Y. Cheng, C.-N. Chen, C.-C. Chieng, F. G. Tseng, J. T. Sheu
Restrictions in the design of gear wheel components and drives for micro technology
A. Albers, N. Burkardt, J. Marz
Study of silicon backside damage in deep reactive ion etching for bonded silicon–glass structures
Y. Yoshida, M. Kumagai, K. Tsutsumi
Ultra thin ICs and MEMS elements: techniques for wafer thinning, stress-free separation, assembly and interconnection
M. Feil, C. Alder, G. Klink, M. König, C. Landesberger, S. Scherbaum, G. Schwinn, H. Spöhrle
High-aspect-ratio microstructures fabricated by X-ray lithography of polymethylsilsesquioxane-based spin-on glass thick films
Y. Liu, T. Cui, P. J. Coane, M. J. Vasile, J. Goettert
A new approach for handling and transferring of thin semiconductor materials
J. Bagdahn, H. Knoll, M. Wiemer, M. Petzold
Uncertainty in measurement of semiconductor piezoresistive sensors
P. L. P. Hoa, G. Gerlach, G. Suchaneck
Numerical simulation of thermal distortions in deep and ultra deep X-ray lithography
S. Achenbach, F. J. Pantenburg, J. Mohr
Injection molding for microstructures controlling mold-core extrusion and cavity heat-flux
C. Yan, M. Nakao, T. Go, K. Matsumoto, Y. Hatamura