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Microsystem Technologies

Issue 3/2012

Content (17 Articles)

Review Paper

Temperature compensation of micromachined silicon hot wire sensor using ANN technique

M. Laghrouche, B. Idjeri, K. Hammouche, M. Tahanout, J. Boussey, S. Ameur

Technical Paper

Mechanical and tribological characterization of a thermally actuated MEMS cantilever

Marius Pustan, Véronique Rochus, Jean-Claude Golinval

Technical Paper

Hot embossing at viscous state to enhance filling process for complex polymer structures

Xuelin Zhu, Terrence W. Simon, Tianhong Cui

Technical Paper

Flexible balloon actuators for active flow control

Haifeng Lv, Chengyu Jiang, Hui Hou, Zhou Zhou, Jinjun Deng, Binghe Ma, Weizheng Yuan

Technical Paper

Design and characterization of an integrated multifunction micro sensor

Yulong Zhao, Weizhong Wang, Bian Tian, Libo Zhao, Zhuangde Jiang

Technical Paper

Design and fabrication of a resonant scanning micromirror suspended by V shaped beams with vertical electrostatic comb drives

Xiao-Ying Li, Qian Jin, Da-Yong Qiao, Bao-Peng Kang, Bin Yan, Yao-Bo Liu

Technical Paper

Flip chip solder bump inspection using vibration analysis

Junchao Liu, Tielin Shi, Qi Xia, Guanglan Liao

Technical Paper

Disposable microfluidic chip for rapid pathogen identification with DNA microarrays

Johannes R. Peham, Lisa-Maria Recnik, Walter Grienauer, Michael J. Vellekoop, Christa Nöhammer, Herbert Wiesinger-Mayr

Technical Paper

A three-axis SOI accelerometer sensing with both in-plane and vertical comb electrodes

Jin Xie, Rahul Agarwal, Youhe Liu, Julius Minglin Tsai

Technical Paper

Improved process flow for buried channel fabrication in silicon

Z. Fekete, A. Pongrácz, P. Fürjes, G. Battistig

Technical Paper

Fabrication of polystyrene microfluidic devices using a pulsed CO2 laser system

Huawei Li, Yiqiang Fan, Rimantas Kodzius, Ian G. Foulds