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Microsystem Technologies

Issue 3/2026

Content (12 Articles)

A review of recent advancements on materials and methods for microelectromechanical system-based devices

  • Review Paper

Swarnalatha Veerla, Sreejith Vattaparambil Sreedharan, Shuai Ju, Mitali Hardik Desai, Haifeng Zhang

Artificial Intelligence enabled data analysis for microfluidic impedance flow cytometry: a comprehensive review

  • Review Paper

Shanshan Li, Ruohan Li, Sheng Pang, Junwei Li

Damping in vertical comb-drive microactuators at different pressures

  • Open Access
  • Technical Paper

Varun P. Sharma, Tapas Ganguli, S. K. Rai, Rahul Shukla

Design, fabrication, and testing of a detonation plasma switch based on micro-electro-mechanical systems

  • Technical Paper

Shuai Chen, Xiangjin Zhang, Wenjie Jiao, Zhenwei Chu, Chenyang Zhang, Na Shen, Yu Zheng, Xiaobin Shen

Fabrication of micro-droplet generating microfluidic master mold using reverse laser engraving

  • Technical Paper

Quan Truong Nguyen, Uyen Thu Pham, Duong Thanh Nguyen, Ngoan Thanh Tran, Linh Diep Dang, Hieu Minh Hoang, Doanh Van Nguyen

High-sensitivity 4H-SiC piezoresistive pressure sensor for stable operation at 500 °C: chip manufacturing and high-temperature packaging

  • Technical Paper

Cheng Lei, Bo Li, Zhiqiang Li, Jiangang Yu, Pinggang Jia, Yongwei Li, Ruirui Li, Fengchao Li, Ting Liang

Performance analysis of quad-port graphene-based MIMO antennas on silicon nitride and quartz substrates for terahertz applications

  • Technical Paper

Govind Kumar Pandey, Rama Rao Thipparaju, Rupesh Kumar, Uday Kumar Singh

Controlling creep in RF MEMS switch cantilever beams via chamfering

  • Technical Paper

Jiangtao Wei, Yulong Zhang, Zewen Liu

Adaptive coupling-driven functional dynamics for adatom-double adsorber microsystem with Holey phononic intercore for nanomass sensing

  • Technical Paper

Brahim Said Djellali, Hicham Bourouina, Abir Lamari, Lamine Elaihar, Soumia Khouni, Yahia Maiza, Mohamed Mektout

Experimental and numerical investigation on microchannel heat transfer in copper matrix composites reinforced with SiC whiskers

  • Technical Paper

Liyan Lai, Yuxiao Bi, Feng Qian, Guilian Wang, Yigui Li, Guifu Ding

Development of a cost-effective diamond shim-based microchannel heat sink for power devices

  • Technical Paper

Yaohua Li, Yingxue Qian

Scale-dependent simulation of nonlocal dual-phase-lag thermoelastic dissipation and frequency shift in circular nanoplate resonators via the frequency-based method

  • Technical Paper

Abdulilah Mohammad Mayet, Salman Arafath Mohammed, Shamimul Qamar, Neeraj Kumar Shukla, Mohammed Abdul Muqeet

Feb 26
Issue: 2/2026
Apr 26
Issue: 4/2026

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