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Microsystem Technologies

Issue 3-4/2007

HARMST, High Aspect Ratio Micro Structure Technology Workshop, Gyenogju, Korea, 10-13 Jnue 2005 (This is the first of two issues)

Content (32 Articles)

Technical paper

Geometrical strengthening and tip-sharpening of a microneedle array fabricated by X-ray lithography

Sommawan Khumpuang, Mitsuhiro Horade, Kazuya Fujioka, Susumu Sugiyama

Technical paper

Mask design compensation for sloped sidewall structures fabricated by X-ray lithography

Mitsuhiro Horade, Sommawan Khumpuang, Kazuya Fujioka, Susumu Sugiyama

Technical Paper

Fabrication of high aspect ratio nano gratings using SR lithography

Fumiki Kato, Shinya Fujinawa, Yigui Li, Susumu Sugiyama

Technical paper

Processing-microstructure-resulting materials properties of LIGA Ni

K. Lian, J. C. Jiang, Z. G. Ling

Technical Paper

Method for polymer hot embossing process development

Proyag Datta, Jost Goettert

Technical Paper

Design and fabrication of a SU-8 based electrostatic microactuator

Wen Dai, Kun Lian, Wanjun Wang

Technical paper

Effect of seed layer stress on the fabrication of monolithic MEMS microstructure

C. K. Chung, Y. J. Fang, C. M. Cheng, Y. Z. Hong, C. H. Wang

Technical Paper

Micro-specific design flow for tool-based microtechnologies

Albert Albers, Norbert Burkardt, Tobias Deigendesch, Jochen Marz

Technical paper

SU-8: promising resist for advanced direct LIGA applications for high aspect ratio mechanical microparts

J. Kouba, R. Engelke, M. Bednarzik, G. Ahrens, Heinz-Ulrich Scheunemann, G. Gruetzner, B. Loechel, H. Miller, D. Haase

Technical Paper

Investigations on possibilities of inline inspection of high aspect ratio microstructures

Rainer Engelke, Gisela Ahrens, Norbert Arndt-Staufenbiehl, Stefan Kopetz, Karin Wiesauer, Bernd Löchel, Henning Schröder, Johann Kastner, Andreas Neyer, David Stifter, Gabi Grützner

Technical Paper

Direct LIGA service for prototyping: status report

B. Loechel, J. Goettert, Y. M. Desta

Technical paper

A new removable resist for high aspect ratio applications

Matthias Schirmer, Doris Perseke, Eva Zena, Daniel Schondelmaier, Ivo Rudolph, Bernd Loechel

Technical Paper

Microlens fabrication using an etched glass master

P. Zhang, G. Londe, J. Sung, E. Johnson, M. Lee, H. J. Cho

Technical Paper

Fabrication of RF MEMS variable capacitors by deep X-ray lithography and electroplating

Sven Achenbach, David Klymyshyn, Darcy Haluzan, Timo Mappes, Garth Wells, Jürgen Mohr

Technical Paper

Structure quality in deep X-ray lithography applying commercial polyimide-based masks

Sven Achenbach, Martin Boerner, Seichin Kinuta, Walter Bacher, Juergen Mohr, Volker Saile, Yasunori Saotome

Technical Paper

Fabrication of micro-gas chromatograph columns for fast chromatography

Abhinav Bhushan, Dawit Yemane, Dan Trudell, Edward B. Overton, Jost Goettert

Technical Paper

A hybrid approach for fabrication of polymeric BIOMEMS devices

Varshni Singh, Yohannes Desta, Proyag Datta, Jason Guy, Mark Clarke, Daniel L. Feedback, J. Weimert, Jost Goettert

Technical Paper

Large area micro hot embossing of Pyrex glass with GC mold machined by dicing

Masaharu Takahashi, Yoichi Murakoshi, Ryutaro Maeda, Kohei Hasegawa

Technical paper

Development of precision transfer technology of atmospheric hot embossing by ultrasonic vibration

Harutaka Mekaru, Osamu Nakamura, Osamu Maruyama, Ryutaro Maeda, Tadashi Hattori

Technical paper

Fabrication of a spiral microcoil using a 3D-LIGA process

Harutaka Mekaru, Shinji Kusumi, Noriaki Sato, Masami Shimizu, Michiru Yamashita, Osamu Shimada, Tadashi Hattori

Technical Paper

Study of PMMA thermal bonding

Xuelin Zhu, Gang Liu, Yuhua Guo, Yangchao Tian

Erratum

High aspect ratio air core solenoid inductors using an improved UV-LIGA process with contrast enhancement material

Hong Lu, Brandon Pillans, Jong-Chan Lee, Kyunghwan Kim, Jeong-Bong Lee