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Microsystem Technologies

Issue 5/2004

Content (36 Articles)

Technical Papers

“Plug-up”—a new concept for fabricating SOI MEMS devices

J. Kiihamäki, J. Dekker, P. Pekko, H. Kattelus, T. Sillanpää, T. Mattila

“Plug-up”–a new concept for fabricating SOI MEMS devices

J. Kiihamäki, J. Dekker, P. Pekko, H. Kattelus, T. Sillanpää, T. Mattila

Technical Papers

New electroforming technology pressure aid for LIGA process

T. -H. Tsai, H. Yang, R. Chein

Technical Papers

SU8 resist plasma etching and its optimisation

G. Hong, A. S. Holmes, M. E. Heaton

SU8 resist plasma etching and its optimisation

G. Hong, A.S. Holmes, M.E. Heaton

Technical Papers

Thin film formation on non-planar surface with use of spray coating fabrication

M. Ichiki, L. Zhang, Z. Yang, T. Ikehara, R. Maeda

Thin film formation on non-planar surface with use of spray coating fabrication

M. Ichiki, L. Zhang, Z. Yang, T. Ikehara, R. Maeda

Technical Papers

Self-aligned 0-level sealing of MEMS devices by a two layer thin film reflow process

C. Rusu, H. Jansen, R. Gunn, A. Witvrouw

Technical Papers

Bonding of polymer microstructures by UV irradiation and subsequent welding at low temperatures

R. Truckenmüller, P. Henzi, D. Herrmann, V. Saile, W. K. Schomburg

Bonding of polymer microstructures by UV irradiation and subsequent welding at low temperatures

R. Truckenmüller, P. Henzi, D. Herrmann, V. Saile, W.K. Schomburg

Technical Papers

Modular parametric finite element modelling for reliability-studies in electronic and mems packaging

B. Wunderle, J. Auersperg, V. Großer, E. Kaulfersch, O. Wittler, B. Michel

Modular parametric finite element modelling for reliability-studies in electronic and mems packaging

B. Wunderle, J. Auersperg, V. Großer, E. Kaulfersch, O. Wittler, B. Michel

Technical Papers

Feasibility of a flip-chip approach to integrate an IR filter and an IR detector in a future gas detection cell

L. Fonseca, E. Cabruja, C. Calaza, R. Rubio, J. Santander, E. Figueras, I. Gràcia, C. Cané, M. Moreno, S. Marco

Feasibility of a flip-chip approach to integrate an IR filter and an IR detector in a future gas detection cell

L. Fonseca, E. Cabruja, C. Calaza, R. Rubio, J. Santander, E. Figueras, I. Gràcia, C. Cané, M. Moreno, S. Marco

Technical Papers

Dynamic modeling of interactions between fields and matter in MEMS devices

K. Zeng, Z. Liu, J. G. Korvink

Technical Papers

Parallel-beams/lever electrothermal out-of-plane actuator

S. Deladi, G. Krijnen, M. C. Elwenspoek

Parallel-beams/lever electrothermal out-of-plane actuator

S. Deladi, G. Krijnen, M.C. Elwenspoek

Technical Papers

Design and simulation of MEMS optical switch using photonic bandgap crystal

H. G. Teo, A. Q. Liu, J. Singh, M. B. Yu, T. Bourouina

Design and simulation of MEMS optical switch using photonic bandgap crystal

H.G. Teo, A.Q. Liu, J. Singh, M.B. Yu, T. Bourouina

Technical Papers

Yield strength of thin-film parylene-C

C. Y. Shih, T. A. Harder, Y. C. Tai

Yield strength of thin-film parylene-C

C.Y. Shih, T.A. Harder, Y.C. Tai

Technical Papers

Fracture behaviour of single crystal silicon microstructures

F. Favalli Meroni, E. Mazza

Technical Papers

Ensuring repeatability in LIGA mold insert fabrication

J. Schulz, K. Bade, M. Guttmann, L. Hahn, A. Janssen, U. Köhler, P. Meyer, F. Winkler

Ensuring repeatability in LIGA mold insert fabrication

J. Schulz, K. Bade, M. Guttmann, L. Hahn, A. Janssen, U. Köhler, P. Meyer, F. Winkler

Technical Papers

Design, fabrication, and test of a peristaltic micropump

M. Knight, J. House

Technical Papers

New aspects of simulation in hot embossing

M. Worgull, M. Heckele