Issue 5/2004
Content (36 Articles)
Microsystem technologies: Foreword to special issue on design, test, integration and packaging of MEMS/MOEMS, 2003
Bernard Courtois, Bernd Michel
Microsystem Technologies: Foreword to special issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2003
Bernard Courtois, Bernd Michel
“Plug-up”—a new concept for fabricating SOI MEMS devices
J. Kiihamäki, J. Dekker, P. Pekko, H. Kattelus, T. Sillanpää, T. Mattila
“Plug-up”–a new concept for fabricating SOI MEMS devices
J. Kiihamäki, J. Dekker, P. Pekko, H. Kattelus, T. Sillanpää, T. Mattila
New electroforming technology pressure aid for LIGA process
T. -H. Tsai, H. Yang, R. Chein
Thin film formation on non-planar surface with use of spray coating fabrication
M. Ichiki, L. Zhang, Z. Yang, T. Ikehara, R. Maeda
Thin film formation on non-planar surface with use of spray coating fabrication
M. Ichiki, L. Zhang, Z. Yang, T. Ikehara, R. Maeda
Self-aligned 0-level sealing of MEMS devices by a two layer thin film reflow process
C. Rusu, H. Jansen, R. Gunn, A. Witvrouw
Self-aligned 0-level sealing of MEMS devices by a two layer thin film reflow process
A. Witvrouw, C. Rusu, H. Jansen, R. Gunn
Bonding of polymer microstructures by UV irradiation and subsequent welding at low temperatures
R. Truckenmüller, P. Henzi, D. Herrmann, V. Saile, W. K. Schomburg
Bonding of polymer microstructures by UV irradiation and subsequent welding at low temperatures
R. Truckenmüller, P. Henzi, D. Herrmann, V. Saile, W.K. Schomburg
Modular parametric finite element modelling for reliability-studies in electronic and mems packaging
B. Wunderle, J. Auersperg, V. Großer, E. Kaulfersch, O. Wittler, B. Michel
Modular parametric finite element modelling for reliability-studies in electronic and mems packaging
B. Wunderle, J. Auersperg, V. Großer, E. Kaulfersch, O. Wittler, B. Michel
Feasibility of a flip-chip approach to integrate an IR filter and an IR detector in a future gas detection cell
L. Fonseca, E. Cabruja, C. Calaza, R. Rubio, J. Santander, E. Figueras, I. Gràcia, C. Cané, M. Moreno, S. Marco
Feasibility of a flip-chip approach to integrate an IR filter and an IR detector in a future gas detection cell
L. Fonseca, E. Cabruja, C. Calaza, R. Rubio, J. Santander, E. Figueras, I. Gràcia, C. Cané, M. Moreno, S. Marco
Dynamic modeling of interactions between fields and matter in MEMS devices
K. Zeng, Z. Liu, J. G. Korvink
Dynamic modeling of interactions between fields and matter in MEMS devices
K. Zeng, Z. Liu, J.G. Korvink
Parallel-beams/lever electrothermal out-of-plane actuator
S. Deladi, G. Krijnen, M. C. Elwenspoek
Design and simulation of MEMS optical switch using photonic bandgap crystal
H. G. Teo, A. Q. Liu, J. Singh, M. B. Yu, T. Bourouina
Design and simulation of MEMS optical switch using photonic bandgap crystal
H.G. Teo, A.Q. Liu, J. Singh, M.B. Yu, T. Bourouina
Fracture behaviour of single crystal silicon microstructures
F. Favalli Meroni, E. Mazza
Ensuring repeatability in LIGA mold insert fabrication
J. Schulz, K. Bade, M. Guttmann, L. Hahn, A. Janssen, U. Köhler, P. Meyer, F. Winkler
Ensuring repeatability in LIGA mold insert fabrication
J. Schulz, K. Bade, M. Guttmann, L. Hahn, A. Janssen, U. Köhler, P. Meyer, F. Winkler
Development of a novel self-sensitive atomic force microscope for nondestructive measurement of micro vertical surfaces
T. Kobayashi, Y. Murakoshi, R. Maeda
Development of a novel self-sensitive atomic force microscope for nondestructive measurement of micro vertical surfaces
T. Kobayashi, Y. Murakoshi, R. Maeda