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Science China Technological Sciences
Published in: Science China Technological Sciences 9/2012

01-09-2012

Modeling of void closure in diffusion bonding process based on dynamic conditions

Authors: RuiFang Ma, MiaoQuan Li, Hong Li, WeiXin Yu

Published in: Science China Technological Sciences | Issue 9/2012

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Metadata
Title
Modeling of void closure in diffusion bonding process based on dynamic conditions
Authors
RuiFang Ma
MiaoQuan Li
Hong Li
WeiXin Yu
Publication date
01-09-2012
Publisher
SP Science China Press
Published in
Science China Technological Sciences / Issue 9/2012
Print ISSN: 1674-7321
Electronic ISSN: 1869-1900
DOI
https://doi.org/10.1007/s11431-012-4927-1

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