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2023 | OriginalPaper | Chapter

9. Monitoring the Response of Electrical Components During Environmental Vibration Tests Using a Scanning Laser Doppler Vibrometer

Authors : Caleb R. Heitkamp, Benjamin L. Martins

Published in: Rotating Machinery, Optical Methods & Scanning LDV Methods, Volume 6

Publisher: Springer International Publishing

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Abstract

An experimental study was performed in which the response of a fully populated printed circuit board was monitored during an environmental vibration test using both an accelerometer and a scanning laser vibrometer. The test article was subjected to a random vibration profile typical of electrical components during a vibration test. A response accelerometer was shown to significantly alter the dynamics of the primary flexible mode of several components on the printed circuit board when the accelerometer was attached to the component of interest. The results of this experimental study demonstrate that a laser vibrometer can provide accurate single-point response measurements and can characterize the operational shapes of the test article during a vibration test.

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Literature
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go back to reference Fackler, W.C.: Equivalence Techniques for Vibration Testing. United States, Shock and Vibration Information Center, U.S. Department of Defense (1972) Fackler, W.C.: Equivalence Techniques for Vibration Testing. United States, Shock and Vibration Information Center, U.S. Department of Defense (1972)
2.
go back to reference Thukral, V., Cahu, M., Zaal, J.J.M., Jalink, J., Roucou, R., Rongen, R.T.H.: Assessment of accelerometer versus LASER for board level vibration measurements. In: IEEE 69th Electronic Components and Technology Conference (ECTC), pp. 1339–1346 (2019)CrossRef Thukral, V., Cahu, M., Zaal, J.J.M., Jalink, J., Roucou, R., Rongen, R.T.H.: Assessment of accelerometer versus LASER for board level vibration measurements. In: IEEE 69th Electronic Components and Technology Conference (ECTC), pp. 1339–1346 (2019)CrossRef
3.
go back to reference Roucou, R., Zaal, J.J.M., Jalink, J., Heus, R., Rongen, R.T.H.: Effect of environmental and testing conditions on board level vibration. In: IEEE 66th Electronic Components and Technology Conference (ECTC), pp. 1105–1111 (2016)CrossRef Roucou, R., Zaal, J.J.M., Jalink, J., Heus, R., Rongen, R.T.H.: Effect of environmental and testing conditions on board level vibration. In: IEEE 66th Electronic Components and Technology Conference (ECTC), pp. 1105–1111 (2016)CrossRef
Metadata
Title
Monitoring the Response of Electrical Components During Environmental Vibration Tests Using a Scanning Laser Doppler Vibrometer
Authors
Caleb R. Heitkamp
Benjamin L. Martins
Copyright Year
2023
DOI
https://doi.org/10.1007/978-3-031-04098-6_9

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