Numerical Investigation of Finned Heat Sinks with PCM for Electronics Thermal Management: A Parametric Study

This chapter delves into the critical role of thermal management in modern electronic devices, focusing on the use of phase change materials (PCMs) and fin geometries to enhance heat dissipation. The study evaluates three PCMs—RT44, n-eicosane, and paraffin wax—and their effectiveness in reducing base temperatures under a constant heat flux. Among these, n-eicosane demonstrates the best cooling performance, significantly lowering the base temperature compared to the other materials. Additionally, the investigation explores the impact of fin shapes—circular, triangular, and hexagonal—on thermal efficiency. Triangular fins prove to be the most effective, promoting uniform melting and superior heat transfer. The findings underscore the importance of selecting appropriate PCMs and fin designs to optimize passive cooling in electronic systems. This research provides valuable guidance for engineers and designers aiming to improve the thermal performance and reliability of electronic devices.