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Journal of Materials Science: Materials in Electronics

Preparation of gold-decorated silver nanowires for improving conductivity of electrically conductive adhesives

  • 06-08-2020
Published in:
Authors
Jing Lu
Tianlong Han
Junfu Dai
Published in
Journal of Materials Science: Materials in Electronics | Issue 17/2020

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Abstract

Excellent electrical conductivity generally conflicts with high lap shear strength for electrically conductive adhesives (ECAs). One-dimensional silver nanowires (AgNWs) as conductive fillers can effectively solve the problem. However, insulating ligands on the nanowires will form a large contact resistance between the nanowires and limit the electrical conductivity of ECAs. In this work, we reported a one-step method to prepare Au-decorated AgNW conductive fillers. Through controlling the filler content, curing temperature, and curing time, the ECAs filled with Au-decorated AgNWs obtained exceptional electrical performance. When the filler content was 39 wt%, the resistivity reached to 7.8 × 10−5 Ω cm, which had a strong competitiveness to tin–lead solder. Therefore, the feature opens up possibilities for ECAs filled with the hybrid nanofiller to completely replace traditional solder.

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Title
Preparation of gold-decorated silver nanowires for improving conductivity of electrically conductive adhesives
Authors
Jing Lu
Tianlong Han
Junfu Dai
Publication date
06-08-2020
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 17/2020
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-020-04022-1
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