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Published in: Journal of Nanoparticle Research 11/2022

01-11-2022 | Research paper

Pressureless sintering performance enhancement of Ag pastes by surface modification of Ag nanoparticles with tert-dodecyl mercaptan

Authors: Xingwang Shen, Shuang Xi, Liang Xu, Tao Zhao, Rong Sun, Junjie Li

Published in: Journal of Nanoparticle Research | Issue 11/2022

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Abstract

A rising variety of power devices based on wide-bandgap (WBG) semiconductors are employed in products that can service at high temperatures consistently for extending the working life. Traditional tin–lead and lead-free solders are no longer suitable for power device packaging. Recently, nano-Ag pressureless sintering technology has attracted widespread attention for high-temperature application. When commercial Ag powders are applied, satisfactory sintering quality is often not obtained due to unstable product batches, unknown surface cladding, and poor sintering performance. In this work, Ag nanoparticles are surface modified with tert-dodecyl mercaptan (TDM) to prevent agglomeration at room temperature for improving pressureless sintering performance. We systematically introduced the modification process of Ag nanoparticles and Ag paste preparation and sintering process and compared the changes in the sintering performance of modified Ag nanoparticles with different TDM contents. With a minor amount of TDM, 1.5% of the total weight of Ag, the sintering performance of the Ag paste can be effectively improved and the porosity reduced. The highest average shear strength of the bonded joints based on modified Ag nanoparticles is up to 46.82 MPa with only 6.1% porosity by pressureless and low-temperature sinter at 250 °C for 10 min in ambient air, and the sintering morphology is better than the joints without nanoparticle modification. At the same time, increasing the sintering time does not have much effect on the bond strength, which indicated that 10 min already formed a high-quality joint. The analysis reveals that TDM molecules can be absorbed on the surface of Ag nanoparticles by headgroups to form a coating layer. The mechanism of TDM modification to enhance the sintering performance is also proposed, which provides theoretical support for the practical application of the pressureless Ag sintering technology.

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Appendix
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Literature
22.
go back to reference Mysliwiec M, Kisiel R, Pavlov K, Kruszewski MJ (2022) Pressureless Direct Bonding of Au Metallized Substrate with Si Chips by Micro-Ag Particles. In: 2022 45th International Spring Seminar on Electronics Technology (ISSE). IEEE, Vienna, Austria, pp 1–7 Mysliwiec M, Kisiel R, Pavlov K, Kruszewski MJ (2022) Pressureless Direct Bonding of Au Metallized Substrate with Si Chips by Micro-Ag Particles. In: 2022 45th International Spring Seminar on Electronics Technology (ISSE). IEEE, Vienna, Austria, pp 1–7
Metadata
Title
Pressureless sintering performance enhancement of Ag pastes by surface modification of Ag nanoparticles with tert-dodecyl mercaptan
Authors
Xingwang Shen
Shuang Xi
Liang Xu
Tao Zhao
Rong Sun
Junjie Li
Publication date
01-11-2022
Publisher
Springer Netherlands
Published in
Journal of Nanoparticle Research / Issue 11/2022
Print ISSN: 1388-0764
Electronic ISSN: 1572-896X
DOI
https://doi.org/10.1007/s11051-022-05591-4

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