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Published in: Journal of Materials Science: Materials in Electronics 7/2013

01-07-2013

Properties of pulse electrodeposited copper gallium sulphide films

Authors: S. Vadivel, K. Srinivasan, K. R. Murali

Published in: Journal of Materials Science: Materials in Electronics | Issue 7/2013

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Abstract

Copper gallium sulphide films were deposited for the first time by the pulse electrodeposition technique at different duty cycles in the range of 6–50 % at room temperature and at a constant current density of 1.0 mA cm−2. The films exhibited single phase copper gallium sulphide. The grain size increased from 30 to 70 nm with increase of duty cycle. Optical band gap of the films varied in the range of 2.30–2.36 eV. The resistivity increased from 0.10 to 1.70 ohm cm with increase of duty cycle from 6 to 50 %. Preliminary studies on solar cells with p-CuGaS2/n-CuInS2 junction yielded an efficiency of 4.14 %. This is the first report on solar cells using CuGaS2 with CuInS2.

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Literature
1.
go back to reference J.L. Shay, J.H. Wernick, International Series of Monographs on Science of the Solid State, vol. 7 (Pergamon Press, Oxford, 1975) J.L. Shay, J.H. Wernick, International Series of Monographs on Science of the Solid State, vol. 7 (Pergamon Press, Oxford, 1975)
5.
go back to reference M.S. Branch, P.R. Berndt, W.L. Leitch, J. Weber, J.R. Botha, Thin Solid Films 480–481, 188 (2005)CrossRef M.S. Branch, P.R. Berndt, W.L. Leitch, J. Weber, J.R. Botha, Thin Solid Films 480481, 188 (2005)CrossRef
6.
7.
go back to reference S. Chichibu, S. Shirakata, M. Uchida, Y. Harada, T. Wakiyama, S. Matsumoto, H. Higuchi, S. Isomura, Jpn. J. Appl. Phys. 34, 3991 (1995)CrossRef S. Chichibu, S. Shirakata, M. Uchida, Y. Harada, T. Wakiyama, S. Matsumoto, H. Higuchi, S. Isomura, Jpn. J. Appl. Phys. 34, 3991 (1995)CrossRef
10.
11.
13.
17.
go back to reference M. El Sherrif, F.S. Terra, S.A. Khodier, J. Mater. Sci. Mater. Electron. 7, 391 (1996) M. El Sherrif, F.S. Terra, S.A. Khodier, J. Mater. Sci. Mater. Electron. 7, 391 (1996)
19.
go back to reference L.I. Soliman, A.A. Ibrahim, Fizika A 6, 181 (1997) L.I. Soliman, A.A. Ibrahim, Fizika A 6, 181 (1997)
20.
go back to reference M.I. Alonso, K. Wakita, J. Pascua, M. Garriga, N. Yamamoto, Phys. Rev. B 63, 075203 (13 pages) (2001) M.I. Alonso, K. Wakita, J. Pascua, M. Garriga, N. Yamamoto, Phys. Rev. B 63, 075203 (13 pages) (2001)
Metadata
Title
Properties of pulse electrodeposited copper gallium sulphide films
Authors
S. Vadivel
K. Srinivasan
K. R. Murali
Publication date
01-07-2013
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 7/2013
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-013-1124-3

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