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Published in: Microsystem Technologies 1/2018

01-10-2016 | Technical Paper

Random dispersion effects of conductive particles on anisotropic conductive film’s (ACF’s) bonding yield

Authors: Chao-Ming Lin, Mao-Chieh Chi, Yen-Chun Liu

Published in: Microsystem Technologies | Issue 1/2018

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Abstract

In this study, the authors try to analyze the failure probability of Anisotropic Conductive Film (ACF) packages using V-shaped curve method considering the random effects with random dispersion of conductive particles. It is shown that the dependencies of the coefficient of variation (CV) and the failure probability on the volume fraction are investigated and the results are then used to construct a correlation between the random error and the CV for a specified volume fraction. The results presented in this study have shown that the failure probability and random error are reduced as the value of the volume fraction approaches the values corresponding to the tip of the V-shaped curve. In additional, the V-shaped curves in the failure probabilities are moved from lower to higher with the increasing CV, and the optimal designed volume fraction will linearly increase with increasing CV. Hence, when specifying the composition of the ACF compound with any random error, the volume fraction should be assigned the tip value in order to maximize the reliability of the failure probability.

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Metadata
Title
Random dispersion effects of conductive particles on anisotropic conductive film’s (ACF’s) bonding yield
Authors
Chao-Ming Lin
Mao-Chieh Chi
Yen-Chun Liu
Publication date
01-10-2016
Publisher
Springer Berlin Heidelberg
Published in
Microsystem Technologies / Issue 1/2018
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-016-3153-3

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