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Published in: Journal of Materials Science: Materials in Electronics 6/2010

01-06-2010

Reactive nanolayers for physiologically compatible microsystem packaging

Authors: Xiaotun Qiu, David Welch, Jennifer Blain Christen, Jie Zhu, Jon Oiler, Cunjiang Yu, Ziyu Wang, Hongyu Yu

Published in: Journal of Materials Science: Materials in Electronics | Issue 6/2010

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Abstract

This paper described a novel physiologically compatible wafer bonding technique for bio-microelectromechanical systems (bio-MEMS) packaging. Room temperature bonding was performed between Parylene-C and silicon wafers with a thin Parylene-C coating using reactive Ni/Al nanofilms as localized heaters. Live NIH 3T3 mouse fibroblast cells were encapsulated in the package and they survived the bonding process owing to the localization of heating. A numerical model was developed to predict the temperature evolutions in the parylene layers, silicon wafer and the encapsulated liquid during the bonding process. The simulation results were in agreement with the cell encapsulation experiment revealing that localized heating occurred in this bonding approach. This study proved the feasibility of reactive nanofilm bonding technique for broad applications in packaging bio-MEMS and microfluidic systems.

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Metadata
Title
Reactive nanolayers for physiologically compatible microsystem packaging
Authors
Xiaotun Qiu
David Welch
Jennifer Blain Christen
Jie Zhu
Jon Oiler
Cunjiang Yu
Ziyu Wang
Hongyu Yu
Publication date
01-06-2010
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 6/2010
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-009-9957-5

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