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Recovery of copper oxide nanostructures from waste printed circuit boards for environmental remediation: synthesis, characterization, and photocatalytic application investigation

  • 01-11-2025
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Abstract

This study presents a novel approach to recovering copper oxide (CuO) nanoparticles from waste printed circuit boards (WPCBs) and investigating their potential for environmental remediation. The research focuses on the synthesis, characterization, and photocatalytic application of these nanoparticles, with a particular emphasis on their ability to degrade Congo red, a carcinogenic textile dye. The study employs a precursor-free, application-oriented pathway for transforming WPCB-derived copper into functional CuO nanostructures. The synthesized CuO nanoparticles were characterized using various techniques, including XRD, FTIR, SEM-EDX, TEM, XPS, and BET, to analyze their phase, morphology, and dispersed characteristics. The photocatalytic activity of the CuO nanoparticles was assessed for the degradation of Congo red under visible light irradiation. The results demonstrated that the CuO nanoparticles exhibited superior photocatalytic properties, achieving 96.79% degradation of Congo red in 180 minutes. The study highlights the potential of converting e-waste into functional nanomaterials for environmental remediation, contributing to the circular economy by reducing e-waste and generating value-added products. The findings suggest that this strategy can support resource sustainability and deliver both environmental and economic benefits.

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Title
Recovery of copper oxide nanostructures from waste printed circuit boards for environmental remediation: synthesis, characterization, and photocatalytic application investigation
Authors
Pushpa Gautam
Maheswari Yadav
Arup Kumar De
Indrajit Sinha
Arunabh Meshram
Chhail Kumar Behera
Kamalesh Kumar Singh
Publication date
01-11-2025
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 33/2025
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-025-16209-5
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