Skip to main content

Advanced Search

Projected result for your current search: 0

Search Operators:

You can use operators in your search query to narrow down your results even more. Click on the search operator to see an explanation of how it works.
Finds documents with exactly this word group, in exactly this word order and spelling (e.g. "employer branding").
Finds documents with both search terms (e.g. sales AND bonus).
Finds documents with one or the other search term (e.g. porsche OR volkswagen).
Finds documents with all search terms. Blank space is understood as AND (e.g. man robot production).
Finds documents with no appearance of the word behind NOT (e.g. ford NOT "harrison ford").
Finds documents where the search term is mentioned at least "n" times."n" may be any number (e.g. COUNT(gear)>8).
Finds documents with both search terms in any word order, permitting "n" words as a maximum distance between them. Best choose between 15 and 30 (e.g. NEAR(recruit, professionals, 20)).
Finds documents with the search term in word versions or composites. The asterisk * marks whether you wish them BEFORE, BEHIND, or BEFORE and BEHIND the search term (e.g. lightweight*, *lightweight, *lightweight*).
Finds documents with the search term in different spellings. "?" allows only one character (e.g. organi?ation).
Special characters are understood as AND (e.g. Miller Bros. & Sons).

Semantic Search

powered by (Link opens in a new window)
loading …
Log in
Top
Journal of Electronic Materials

Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging

  • 29-03-2024
  • Review Article
Published in:
Authors
Ze Cui
Qiang Jia
Hongqiang Zhang
Yishu Wang
Limin Ma
Guisheng Zou
Fu Guo
Published in
Journal of Electronic Materials | Issue 6/2024

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

The article delves into the critical aspects of shear strength and reliability of nanoparticle sintered joints for power electronics packaging, particularly focusing on wide-bandgap semiconductors like SiC and GaN. It discusses the limitations of traditional packaging methods and the prohibition of Pb-based solders, leading to the exploration of alternative high-temperature packaging solutions. Transient liquid phase bonding and nanoparticle sintering are highlighted as promising techniques, with the latter offering low-temperature bonding that can withstand high working temperatures. The article compares various interconnect materials, emphasizing the advantages of sintered Ag and Cu joints in terms of thermal and electrical properties. It also reviews the reliability of these joints under thermal aging, thermal cycling, thermal shock, and power cycling tests, showcasing their superior performance compared to traditional Sn-based solders. The challenges and future research directions for improving the reliability and industrial applicability of sintered joints are also addressed, making this a must-read for specialists in the field.
AI Generated

This summary of the content was generated with the help of AI.

Please log in to get access to your license.

Log in Register for free

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Business + Economics & Engineering + Technology"

Online-Abonnement

Springer Professional "Business + Economics & Engineering + Technology" gives you access to:

  • more than 102.000 books
  • more than 537 journals

from the following subject areas:

  • Automotive
  • Construction + Real Estate
  • Business IT + Informatics
  • Electrical Engineering + Electronics
  • Energy + Sustainability
  • Finance + Banking
  • Management + Leadership
  • Marketing + Sales
  • Mechanical Engineering + Materials
  • Insurance + Risk


Secure your knowledge advantage now!

inform now

Springer Professional "Engineering + Technology"

Online-Abonnement

Springer Professional "Engineering + Technology" gives you access to:

  • more than 67.000 books
  • more than 390 journals

from the following specialised fileds:

  • Automotive
  • Business IT + Informatics
  • Construction + Real Estate
  • Electrical Engineering + Electronics
  • Energy + Sustainability
  • Mechanical Engineering + Materials





 

Secure your knowledge advantage now!

inform now
next article Spin Splitting and Band Gap Structure in Si[110] Nanowires Doped with Impurities
Title
Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging
Authors
Ze Cui
Qiang Jia
Hongqiang Zhang
Yishu Wang
Limin Ma
Guisheng Zou
Fu Guo
Publication date
29-03-2024
Publisher
Springer US
Published in
Journal of Electronic Materials / Issue 6/2024
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-024-10970-9
This content is only visible if you are logged in and have the appropriate permissions.

Other articles of this Issue 6/2024

PtOx Schottky Contacts on Degenerately Doped β-Ga2O3 Substrates

  • Topical Collection: 65th Electronic Materials Conference 2023

Constant-Stress ADTs and Weibull-Based Lifetime Estimation of LED Lamp

  • Original Research Article

Fast, Sensitive, and Selective Hydrogen Sensing of Silver-Doped Bismuth Sulfide Nanobelts

  • Original Research Article

Investigation of Structure and Performance of Cerium-Doped Lanthanum Fluoride Nanocrystals for Scintillators

  • Original Research Article

Tunable Broadband TiO2@TiC Composites by In Situ Surface Oxidation for Electromagnetic Wave Absorption

  • Original Research Article

Investigation of a Dual-Drain Technique on a Nanowire Tunnel Field-Effect Transistor for Bio-sensitivity Enhancement

  • Original Research Article