Review on warpage mechanisms and control of packaging substrates for large-scale chiplet integration

The article delves into the mechanisms and control of warpage in large-scale packaging substrates, crucial for advanced chiplet integration. It explores the complex interplay of materials, processes, and structural design that influence warpage, highlighting the challenges posed by large-area substrates and the need for low-warpage solutions. The text discusses various control strategies, including process optimization, material improvement, and structural design, as well as advanced techniques like AI-assisted warpage prediction and the development of glass substrate technology. Additionally, it addresses the current inconsistencies between simulation and testing for large-scale substrates and the future directions in warpage control, such as the development of new substrate materials and the challenges of warpage control for glass substrates. The article concludes by emphasizing the importance of considering the curing strain of organic dielectrics and the dynamic stress of electroplated copper to improve warpage simulation accuracy.