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Journal of Materials Science: Materials in Electronics

Sandwich-structured Co3[Co(CN)6]2/P(VDF-HFP) piezoelectric composites with superior electromechanical activity

  • 27-10-2020
Published in:
Authors
Qirui Peng
Lu Yang
Qiuying Zhao
Yizhou Ma
Hongli Ji
Jinhao Qiu
Published in
Journal of Materials Science: Materials in Electronics | Issue 24/2020

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Abstract

The development of piezoelectric polymers with superior electromechanical performance is a demand in the areas of flexible sensors, actuators and tissue engineering, among others. In this work, we reported a novel sandwich-structured piezoelectric composites comprising of poly(vinylidene fluoride-hexafluoropropylene) [P(VDF-HFP)] and Prussian blue analogs Co3[Co(CN)6]2 with excellent electromechanical activities. The large specific surface area, unique three-dimensional porous nanostructure and redox behavior of Co3[Co(CN)6]2 appeared to significantly promote the interfacial coupling effect within P(VDF-HFP), resulting in enhanced electromechanical response. Moreover, the sandwich structure topological design would enlarge the interfacial coupling effect, strengthen the breakdown strength and consequently raise the electromechanical performance. For instance, a maximum piezoelectric coefficient d33 of ~ 41 pC/N can be achieved in the sandwiched composites at a loading of 0.8 wt%, which is 1.78 times that of pure P(VDF-HFP). Furthermore, the sandwiched composites possess superior electromechanical coupling factor k33 up to 0.215, while that of pure P(VDF-HFP) is only 0.134.

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previous article Theoretical and experimental studies on structural and optical properties of two quinoxaline 1,4dioxide derivatives
next article Nb2O5-Li2O-Bi2O3-B2O3 novel glassy system: evaluation of optical, mechanical, and gamma shielding parameters
Title
Sandwich-structured Co3[Co(CN)6]2/P(VDF-HFP) piezoelectric composites with superior electromechanical activity
Authors
Qirui Peng
Lu Yang
Qiuying Zhao
Yizhou Ma
Hongli Ji
Jinhao Qiu
Publication date
27-10-2020
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 24/2020
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-020-04704-w
This content is only visible if you are logged in and have the appropriate permissions.

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