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Microsystem Technologies
Published in: Microsystem Technologies 1/2018

23-12-2017 | Editorial

Special issue on Design, Test, Integration and Packaging of MEMS and MOEMS, 2016

Authors: Pascal Nouet, Bernd Michel

Published in: Microsystem Technologies | Issue 1/2018

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Excerpt

The 2016 edition of the symposium on Design, Test, Integration and Packaging of MEMS and MOEMS (DTIP), the premier MEMS scientific annual event in Europe, was held in Budapest, Hungary, May 30–June 2, 2016. DTIP’2016, organized by Prof. Marta Rencz and her team from Budapest University of Technology and Economics was the 18th edition and has been extremely appreciated by an hundred of attendees for the quality of both scientific and social programs. Oral and poster presentations were carefully selected by the Program Committee to insure a high scientific level. This symposium brought together participants interested in manufacturing of microstructures and/or in design tools and methods to facilitate the design of these microstructures. …
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Metadata
Title
Special issue on Design, Test, Integration and Packaging of MEMS and MOEMS, 2016
Authors
Pascal Nouet
Bernd Michel
Publication date
23-12-2017
Publisher
Springer Berlin Heidelberg
Published in
Microsystem Technologies / Issue 1/2018
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-017-3677-1

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