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2018 | OriginalPaper | Chapter

5. Split-Gate Floating Poly SuperFlash® Memory Technology, Design, and Reliability

Authors : Nhan Do, Hieu Van Tran, Alex Kotov, Vipin Tiwari

Published in: Embedded Flash Memory for Embedded Systems: Technology, Design for Sub-systems, and Innovations

Publisher: Springer International Publishing

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Abstract

Split-gate embedded flash memory technology has been around for a couple of decades and has become a de facto standard for embedded products such as microcontrollers and smart cards. The majority of the large microcontroller and smartcard chip-makers and a series of fabless companies are now using some form of a split-gate embedded flash-memory technology because of its advantages in power, performance, and cost compared with traditional EEPROM or stacked-gate solutions. This chapter covers the fundamentals of split-gate embedded flash memories with an emphasis on SST’s widely adopted SuperFlash® memory technology as an example to demonstrate the benefits of a split-gate embedded flash-memory technologies. The fundamentals of SuperFlash technology, design, reliability, and scalability are discussed in detail in various sections, which would provide a detailed understanding of a split-gate, embedded flash-memory technology.

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Metadata
Title
Split-Gate Floating Poly SuperFlash® Memory Technology, Design, and Reliability
Authors
Nhan Do
Hieu Van Tran
Alex Kotov
Vipin Tiwari
Copyright Year
2018
Book
Embedded Flash Memory for Embedded Systems: Technology, Design for Sub-systems, and Innovations

Print ISBN: 978-3-319-55305-4

Electronic ISBN: 978-3-319-55306-1

Copyright Year: 2018

DOI
https://doi.org/10.1007/978-3-319-55306-1_5