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2022 | OriginalPaper | Chapter

8. Statistical Analysis of Time-to-Breakdown Data

Authors : James U. Gleaton, David Han, James D. Lynch, Hon Keung Tony Ng, Fabrizio Ruggeri

Published in: Fiber Bundles

Publisher: Springer International Publishing

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Abstract

In this chapter, we consider the data from Figures 3, 6, and 14 in Kim and Lee (2004) as well as their Weibull analyses of these figures and analysis of their Figure 14. We use this data to see the role that the Weibull plays in their analysis, the physical interpretation of the Weibull shape and scale, and the BD formalism. In addition, other distributions are used to compare with the Weibull and to study the legitimacy of some of the BD formalism assumptions.

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Footnotes
1
The original data for Figures 3 and 6 of Kim and Lee’s is not available. The figures and analyses in Chapter 8 are based on data we constructed visually from Figures 3 and 6. We want to thank Professor Jack C. Lee for his efforts, though unsuccessful, in trying to provide the original data. We also want to thank Professor Jia-Liang Le for the cycles to failure data for Kim and Lee’s (2004) Figure 14; Le used this in his (2012) Figure 4 Weibull plots.
 
Literature
go back to reference Kim, Y.-H., & Lee, J. C. (2004). Reliability characteristics of high-k dielectrics. Microelectronics Reliability, 44(2), 183–193.CrossRef Kim, Y.-H., & Lee, J. C. (2004). Reliability characteristics of high-k dielectrics. Microelectronics Reliability, 44(2), 183–193.CrossRef
go back to reference Le, J.-L. (2012). A finite weakest-link model of lifetime distribution of high-k gate dielectrics under unipolar AC voltage stress. Microelectronics Reliability, 52(1), 100–106.CrossRef Le, J.-L. (2012). A finite weakest-link model of lifetime distribution of high-k gate dielectrics under unipolar AC voltage stress. Microelectronics Reliability, 52(1), 100–106.CrossRef
Metadata
Title
Statistical Analysis of Time-to-Breakdown Data
Authors
James U. Gleaton
David Han
James D. Lynch
Hon Keung Tony Ng
Fabrizio Ruggeri
Copyright Year
2022
DOI
https://doi.org/10.1007/978-3-031-14797-5_8

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