Study on shear properties of Cu–Sn full IMC graphene composite solder joints

This study delves into the effects of graphene on the shear strength and fracture morphology of Cu–Sn full intermetallic compound (IMC) solder joints, which are crucial for high-temperature electronic packaging. The research explores how varying graphene content influences the microstructure and mechanical properties of these advanced solder materials. Key findings reveal that graphene significantly refines the grain size of Cu6Sn5 and Cu3Sn phases, enhancing the shear strength of the solder joints. The study also investigates the different forms of graphene within the solder joints and their impact on mechanical properties. Notably, the shear strength of the solder joints increases with graphene content, reaching a 32.2% improvement at 0.54wt% graphene. The analysis of fracture morphology provides insights into the distribution and effect of graphene within the solder joints, highlighting the importance of graphene content in optimizing the performance of these materials. This research offers valuable data for professionals seeking to enhance the reliability and performance of electronic packaging in demanding environments.