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The Effect of Thermal History on the Microstructure of SnAgCu/SnBiAg Mixed Assemblies

  • 30-09-2020
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Title
The Effect of Thermal History on the Microstructure of SnAgCu/SnBiAg Mixed Assemblies
Authors
Mohammed Genanu
Faramarz Hadian
Randy Owen
Eric J. Cotts
Publication date
30-09-2020
Publisher
Springer US
Published in
Journal of Electronic Materials / Issue 1/2021
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-020-08474-3

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