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Journal of Electronic Materials
Published in: Journal of Electronic Materials 2/2017

31-10-2016

Thermal Fatigue Behavior of Silicon-Carbide-Doped Silver Microflake Sinter Joints for Die Attachment in Silicon/Silicon Carbide Power Devices

Authors: Hao Zhang, Chuantong Chen, Shijo Nagao, Katsuaki Suganuma

Published in: Journal of Electronic Materials | Issue 2/2017

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previous article The Influence of Sintering Temperature on the Microwave Dielectric Properties of Mg2SiO4 Ceramics with CaO-B2O3-SiO2 Addition
next article Influence of Illumination on the Electrical Properties of p-(ZnMgTe/ZnTe:N)/CdTe/n-(CdTe:I)/GaAs Heterojunction Grown by Molecular Beam Epitaxy (MBE)

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Metadata
Title
Thermal Fatigue Behavior of Silicon-Carbide-Doped Silver Microflake Sinter Joints for Die Attachment in Silicon/Silicon Carbide Power Devices
Authors
Hao Zhang
Chuantong Chen
Shijo Nagao
Katsuaki Suganuma
Publication date
31-10-2016
Publisher
Springer US
Published in
Journal of Electronic Materials / Issue 2/2017
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-016-5069-1

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