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2017 | OriginalPaper | Chapter

5. Thermal Management and Cooling

Authors : Jens Lienig, Hans Bruemmer

Published in: Fundamentals of Electronic Systems Design

Publisher: Springer International Publishing

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Abstract

Thermal management must ensure that temperatures within the electronic product always remain within the specified limits. This chapter introduces and elaborates on determining the heat energy produced by a system (Sect. 5.1) and on calculating the heat paths with thermal networks (Sect. 5.2). The heat transfer principles described in Sect. 5.3 will help the reader select and design suitable elements for heat dissipation (Sect. 5.4). They assure compliance with the thermal requirements for various electronic system configurations that are presented in a step-by-step approach in Sect. 5.5. Finally, recommendations for thermally correct systems design will be given in Sect. 5.6.

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Footnotes
1
The temperature source in a thermal network is less a “source” and instead is more an element with a predefined temperature that cannot be impacted by the network. Temperature sources are integrated in the thermal network where constant or predefined temperatures are specified, for example, constant external (room) temperatures.
 
2
The primary exception to this statement is diamond which has a fivefold higher thermal conductivity than copper, but a dielectric strength 10 times higher than rubber.
 
3
While bare surfaces radiate approximately 25% of the dissipated heat (i.e., 75% by convection), painted surfaces radiate roughly 55–60% (i.e., 40–45% by convection).
 
Literature
1.
go back to reference R. Reemsburg, Thermal Design of Electronic Equipment (Electronics Handbook), CRC Press, 2000 R. Reemsburg, Thermal Design of Electronic Equipment (Electronics Handbook), CRC Press, 2000
2.
go back to reference VDI Heat Atlas, 2nd edition, Springer, 2010 VDI Heat Atlas, 2nd edition, Springer, 2010
3.
go back to reference G. N. Dulnjev, N. N. Tarnovski, Teplovye rezimy elektronnoj apparatury, Energija, 1971 G. N. Dulnjev, N. N. Tarnovski, Teplovye rezimy elektronnoj apparatury, Energija, 1971
5.
go back to reference B. Shelkpuk, “Heat Exchangers Cool Hot Plug-in PC Boards”, Electronics, June 27, pp. 114-120, 1974 B. Shelkpuk, “Heat Exchangers Cool Hot Plug-in PC Boards”, Electronics, June 27, pp. 114-120, 1974
6.
go back to reference C. Markert, Erwärmungsprobleme in elektronischen Geräten und ihre konstruktive Berücksichtigung, Ph.D. Thesis, TU Dresden, Dresden, Germany, 1965 C. Markert, Erwärmungsprobleme in elektronischen Geräten und ihre konstruktive Berücksichtigung, Ph.D. Thesis, TU Dresden, Dresden, Germany, 1965
Metadata
Title
Thermal Management and Cooling
Authors
Jens Lienig
Hans Bruemmer
Copyright Year
2017
DOI
https://doi.org/10.1007/978-3-319-55840-0_5