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29-06-2024 | Original Article

Thermal simulation of Al alloy developed by wire arc additive manufacturing using finite element analysis

Authors: Ipsit Mishra, Rajeev Srivastava

Published in: International Journal on Interactive Design and Manufacturing (IJIDeM) | Issue 9/2024

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Abstract

The article delves into the thermal simulation of Al alloy developed through Wire Arc Additive Manufacturing (WAAM) using finite element analysis. It highlights the benefits of WAAM, such as reduced material wastage and high deposition rates, while addressing challenges like residual stress and porosity. The study uses the Goldak heat source model to simulate the temperature profile and heat flux distribution during the deposition of weld beads on an AA 6061 T6 substrate. The results reveal that the topmost layer reaches the highest temperature, and the heat flux is concentrated in a narrow region, contributing to better thermal management. This simulation helps optimize process parameters, making it a valuable resource for professionals seeking to enhance the quality of WAAM-produced parts.

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Literature
1.
go back to reference ASTM: ASTM F2792-12a, Standard Terminology for Additive Manufacturing Technologies; Technical Report 2; ASTM International: West Conshohocken, PA, USA, (2012) ASTM: ASTM F2792-12a, Standard Terminology for Additive Manufacturing Technologies; Technical Report 2; ASTM International: West Conshohocken, PA, USA, (2012)
4.
go back to reference Ralph, B.: Method of making decorative articles. United States, US1533300A. Filed Nov. 12, Granted April 14, 1925. (1920) Ralph, B.: Method of making decorative articles. United States, US1533300A. Filed Nov. 12, Granted April 14, 1925. (1920)
Metadata
Title
Thermal simulation of Al alloy developed by wire arc additive manufacturing using finite element analysis
Authors
Ipsit Mishra
Rajeev Srivastava
Publication date
29-06-2024
Publisher
Springer Paris
Published in
International Journal on Interactive Design and Manufacturing (IJIDeM) / Issue 9/2024
Print ISSN: 1955-2513
Electronic ISSN: 1955-2505
DOI
https://doi.org/10.1007/s12008-024-01973-1

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