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Journal of Electronic Materials
Published in: Journal of Electronic Materials 2/2003

01-02-2003 | Regular Issue Paper

Thermodynamic modeling of the Au-In-Sb ternary system

Authors: H. S. Liu, C. L. Liu, C. Wang, Z. P. Jin, K. Ishida

Published in: Journal of Electronic Materials | Issue 2/2003

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previous article Phase formation and diffusion soldering in Pt/In, Pd/In, and Zr/Sn thin-film systems
next article Effects of Ni thickness and reflow times on interfacial reactions between Ni/Cu under-bump metallization and eutectic Sn-Pb solder in flip-chip technology

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Metadata
Title
Thermodynamic modeling of the Au-In-Sb ternary system
Authors
H. S. Liu
C. L. Liu
C. Wang
Z. P. Jin
K. Ishida
Publication date
01-02-2003
Publisher
Springer-Verlag
Published in
Journal of Electronic Materials / Issue 2/2003
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-003-0240-x

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