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2017 | OriginalPaper | Chapter

29. Thick Films

Author : Neil White

Published in: Springer Handbook of Electronic and Photonic Materials

Publisher: Springer International Publishing

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Abstract

Thick film technology is an example of one of the earliest forms of microelectronics-enabling technologies and it has its origins in the 1950s. At that time it offered an alternative approach to printed circuit board technology and the ability to produce miniature, integrated, robust circuits. It has largely lived in the shadow of silicon technology since the 1960s. The films are deposited by screen printing (stenciling), a graphic reproduction technique that can be dated back to the great Chinese dynasties of around a thousand years ago. Indeed, there is evidence that even early Palaeolithic cave paintings from circa 15000 BC may have been created using primitive stenciling techniques. With the advent of surface-mounted electronic devices in the 1980s, thick film technology again became popular because it allowed the fabrication of circuits without through-hole components.
This chapter will review the main stages of the thick film fabrication process and discuss some of the commonly used materials and substrates. It will highlight the way in which the technology can be used to manufacture hybrid microelectronic circuits. The latter stages of the chapter will demonstrate how the technology has evolved over the past twenty years or so to become an important method in the production of solid state sensors.

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Literature
29.1
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29.2
go back to reference M.A. Topfer: Thick-Film Microelectronics: Fabrication, Design and Fabrication (Van Nostrand-Reinhold, New York 1971) M.A. Topfer: Thick-Film Microelectronics: Fabrication, Design and Fabrication (Van Nostrand-Reinhold, New York 1971)
29.3
go back to reference P.J. Holmes, R.G. Loasby: Handbook of Thick Film Technology (Electrochemical Publ., Ayr 1976) P.J. Holmes, R.G. Loasby: Handbook of Thick Film Technology (Electrochemical Publ., Ayr 1976)
29.4
29.5
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29.6
go back to reference J.E. Brignell, N.M. White, A.W.J. Cranny: Sensor applications of thick-film technology, IEE Proc. Part I 135(4), 77 (1988) J.E. Brignell, N.M. White, A.W.J. Cranny: Sensor applications of thick-film technology, IEE Proc. Part I 135(4), 77 (1988)
29.8
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29.9
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29.16
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Metadata
Title
Thick Films
Author
Neil White
Copyright Year
2017
Publisher
Springer International Publishing
DOI
https://doi.org/10.1007/978-3-319-48933-9_29