Skip to main content
Disciplines
Automotive Business IT + Informatics Construction + Real Estate Electrical Engineering + Electronics Energy + Sustainability Insurance + Risk Finance + Banking Management + Leadership Marketing + Sales Mechanical Engineering + Materials
Events
DE
EN
Books
Journals
Topic Page
Marketing
Start single access now
Access for companies
EXTENDED SEARCH
Log in
Top
Published in:
Cover of the book

2017 | OriginalPaper | Chapter

Time-Domain Analytical Modeling of Current-Mode Signaling Bundled Single-Wall Carbon Nanotube Interconnects

Authors : Yash Agrawal, M. Girish, Rajeevan Chandel

Published in: Proceedings of 2nd International Conference on Intelligent Computing and Applications

Publisher: Springer Singapore

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

Bundled single-wall carbon nanotube (SWCNT) interconnects have been investigated as one of the prominent replacements to copper interconnects in nano-scale regime. This paper investigates the performance of SWCNT bundle interconnect using current-mode signaling (CMS) scheme. Time-domain analytical model is derived for CMS SWCNT bundle interconnects using finite-difference time-domain (FDTD) technique. This model for the first time accurately considers the CMOS gate driver in its analytical FDTD formulation for CMS SWCNT bundle interconnects. The performance of CMS SWCNT bundle interconnect is compared with the conventional CMS copper interconnects. It is investigated that CMS SWCNT bundle interconnects have lower propagation delay than CMS copper interconnects.

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

inform now

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

inform now

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 340 Zeitschriften

aus folgenden Fachgebieten:

  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Versicherung + Risiko




Jetzt Wissensvorsprung sichern!

inform now
next chapter Stability Analysis of Carbon Nanotube Interconnects
Literature
1.
Rai, M.K., Khanna, R., Sarkar, S.: Crosstalk analysis in CNT bundle interconnects for VLSI applications. IEEJ Trans. Electr. Electron. Eng. 9(4), 391–397 (2014)CrossRef
2.
Srivastava, A., Marulanda, J.M., Xu, Y., Sharma, A.K.: Carbon-Based Electronics: Transistors and Interconnects at the Nanoscale. Pan Stanford Publishing, Singapore (2015)CrossRef
3.
Duksh, Y.S., Kaushik, B.K., Agarwal, R.P.: FDTD technique based crosstalk analysis of bundled SWCNT interconnects. J. Semicond. 36(5), 055002–055009 (2015)CrossRef
4.
Sahoo, M., Ghosal, P., Rahaman, H.: Performance modeling and analysis of carbon nanotube bundles for future VLSI circuit applications. J. Comput. Electron. 13(3), 673–688 (2014)CrossRef
5.
Chandel, R., Sarkar, S., Agarwal, R.P.: An analysis of interconnect delay minimization by low-voltage repeater insertion. Microelectron. J. 38(4–5), 649–655 (2007)CrossRef
6.
Bashirullah, R., Liu, W., Cavin, R.K.: Current-mode signaling in deep submicrometer global interconnects. IEEE Trans. Very Large Scale Integr. Syst. 11(3), 406–417 (2003)CrossRef
7.
Agrawal, Y., Chandel, R., Dhiman, R.: High performance current mode receiver design for on-chip VLSI interconnects. Chapter 54. In: Springer Proceedings of the International Conference on ICA. Series: Advances in Intelligent Systems and Computing, vol. 343, pp. 527–536 (2014)
8.
Dave, M., Jain, M., Baghini, M.S., Sharma, D.: A variation tolerant current-mode signaling scheme for on-chip interconnects. IEEE Trans. Very Large Scale Integr. Syst. 21(2), 342–353 (2013)CrossRef
9.
Agrawal, Y., Chandel, R.: Crosstalk analysis of current-mode signalling-coupled RLC interconnects using FDTD technique. IETE Tech Rev 33(2), 148–159 (2016)
10.
Sakurai, T., Newton, A.R.: A simple MOSFET model for circuit analysis. IEEE Trans. Electron Devices 38(4), 887–894 (1991)CrossRef
11.
12.
13.
Metadata
Title
Time-Domain Analytical Modeling of Current-Mode Signaling Bundled Single-Wall Carbon Nanotube Interconnects
Authors
Yash Agrawal
M. Girish
Rajeevan Chandel
Copyright Year
2017
Publisher
Springer Singapore
Book
Proceedings of 2nd International Conference on Intelligent Computing and Applications

Print ISBN: 978-981-10-1644-8

Electronic ISBN: 978-981-10-1645-5

Copyright Year: 2017

DOI
https://doi.org/10.1007/978-981-10-1645-5_1

Premium Partner

    Image Credits