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2017 | OriginalPaper | Chapter

Transfer Printing for Cyber-Manufacturing Systems

Authors : Varun Ravikumar, Ning Yi, Vikas Vepachedu, Huanyu Cheng

Published in: Industrial Internet of Things

Publisher: Springer International Publishing

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Abstract

As a versatile tool, transfer printing provides routes to assemble micro- and nano-structures onto functional substrates, with promising applications ranging from stretchable electronics in diagnostic/therapeutic platforms and human-machine interfaces to dissolvable devices in bio-implants and environmentally benign sensors. The conventional process involves pickup of micro-devices from their fabricated substrates, followed by delivery onto the target substrate of interest. This chapter summarizes the fundamental mechanics and materials aspects of transfer printing, as well as recent developments in advanced techniques that allow for applications in systems with varying levels of complexity. The opportunities and challenges on emerging use for cyber-manufacturing systems are also discussed.

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Title: Transfer Printing for Cyber-Manufacturing Systems
Authors: Varun Ravikumar
Ning Yi
Vikas Vepachedu
Huanyu Cheng
Publisher: Springer International Publishing
Book: Industrial Internet of Things
Print ISBN: 978-3-319-42558-0

Electronic ISBN: 978-3-319-42559-7

Copyright Year: 2017
DOI: https://doi.org/10.1007/978-3-319-42559-7_28

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