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Metallurgical and Materials Transactions A

Ultrafine-Grained Microstructure Development in Cu/Fe Multilayered Sheet During Cooling

  • 22-08-2023
  • Brief Communication
Published in:
Authors
Ryusei Kato
Norimitsu Koga
Chihiro Watanabe
Published in
Metallurgical and Materials Transactions A | Issue 11/2023

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Abstract

The study investigates the microstructure development in Cu/Fe multilayered sheets subjected to different annealing temperatures and cooling rates. The researchers found that rapid cooling from high temperatures results in ultrafine-grained microstructures due to high thermal stresses, while slower cooling rates lead to coarser grains. The formation of these microstructures is driven by the rearrangement of dislocations introduced during cooling. The article highlights the significant role of thermal stress and cooling rate in determining the final microstructure, providing valuable insights for optimizing the mechanical properties of multilayered sheets.
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previous article Nucleation and Growth Dynamics of Equiaxed Dendrites in Thin Metallic Al–Cu and Al–Ge Samples in Microgravity and on Earth
next article Ductile Ti–Ni Alloys With an Equiaxed Microstructure Designed by Tuning the Precipitation Pathway of Ti2Ni
Title
Ultrafine-Grained Microstructure Development in Cu/Fe Multilayered Sheet During Cooling
Authors
Ryusei Kato
Norimitsu Koga
Chihiro Watanabe
Publication date
22-08-2023
Publisher
Springer US
Published in
Metallurgical and Materials Transactions A / Issue 11/2023
Print ISSN: 1073-5623
Electronic ISSN: 1543-1940
DOI
https://doi.org/10.1007/s11661-023-07168-9
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