In Microelectronic and MEMS (Micro-Electro-Mechanical Systems) applications the volume of solder joints decreases rapidly due to higher packaging density. In recent years, many solder alloys have been developed and used. Many of lead-free-solders show a complex material behaviour due to different mechanical and thermal properties throughout the sandwich which can influence the mechanical and thermal reliability as well as the life time. For this reason, ensuring the solder joint reliability is one of the most critical design aspects of electronic assemblies. To predict the failure of solder joints with the help of the FE-Simulations tools, the description of solder behaviour is needed. The mechanical behaviour of solder is non-linear and temperature dependent. Solder alloy in consideration are above 0.5 of their melting point at − 40°C, so creep processes are expected [
]. The failure behaviour of solder is a complex sequence and depends on microstructures, like grain coarsening, micro-voiding, recrystallization, micro-cracking and macro-cracking on alloying content, soldering temperature profile and dissolution of metallizations. Changes of the microstructure can significantly effect the mechanical properties of the solders. Inhomogeneity of solders, espacially of Sn-based lead free solders, can cause local fatigue driven multiple cracking (3,4). Furthermore, plate-like intermetallic compounds (IMC) may cause crack initiation and brittle fracture at interface to metallization, especially if the joint thickness becomes comperable to the IMC-thickness respectively (Figure 1).